Brian Bischoff
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Brian Bischoff Email & Phone Number

Founder at Copprium - Conductive Copper Inks at Copprium
Location: Buffalo-Niagara Falls Area, United States, United States 9 work roles 1 school
1 work email found @k-technologies.com LinkedIn matched
✓ Verified Jun 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email

Work email b****@k-technologies.com
LinkedIn Profile matched
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Current company
Role
Founder at Copprium - Conductive Copper Inks
Location
Buffalo-Niagara Falls Area, United States, United States

Who is Brian Bischoff? Overview

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Quick answer

Brian Bischoff is listed as Founder at Copprium - Conductive Copper Inks at Copprium, based in Buffalo-Niagara Falls Area, United States, United States. AeroLeads shows a work email signal at k-technologies.com and a matched LinkedIn profile for Brian Bischoff.

Brian Bischoff previously worked as Founder / President at Copprium and Off-Shift Maintenance Supervisor at Sumitomo Rubber Usa. Brian Bischoff holds Bachelor'S Degree, Engineering from University At Buffalo.

Company email context

Email format at Copprium

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{first_initial}{last}@k-technologies.com
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AeroLeads found 1 current-domain work email signal for Brian Bischoff. Compare company email patterns before reaching out.

Profile bio

About Brian Bischoff

Brian Bischoff is a Founder at Copprium - Conductive Copper Inks at Copprium. He possess expertise in product development, rapid prototyping, manufacturing, 3d printing, engineering and 5 more skills.

Listed skills include Product Development, Rapid Prototyping, Manufacturing, 3D Printing, and 6 others.

Current workplace

Brian Bischoff's current company

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Copprium
Copprium
Founder at Copprium - Conductive Copper Inks
AeroLeads page
9 roles

Brian Bischoff work experience

A career timeline built from the work history available for this profile.

Founder / President

Current

Buffalo, New York, United States

Jan 2022 - Present

Co-Founder

Current

Buffalo/Niagara, New York Area

Founder of Flexmuch Product Development, SmartPrint3D and later Innosek. Product development companies specializing in Additive Manufacturing

Mar 2015 - Present

Board Member

Wny Invention Convention

Buffalo/Niagara, New York Area

Board Member for Strategic Planning. A non-profit organization that strives to promote creative thinking and encourage scientific problem solving for students in grades K-8. See more at WNYKidsInvent.org

Sep 2017 - Jun 2020

Engineering Manager

Buffalo/Niagara, New York Area

AS9100 / ISO9001 Implementation, Business Development, Technical Sales, Tooling & Fixturing Design, Preventative Maintenance, Floor Support. Sister Company to K-TECHnologies.

Jun 2018 - Apr 2020
1 education record

Brian Bischoff education

FAQ

Frequently asked questions about Brian Bischoff

Quick answers generated from the profile data available on this page.

What company does Brian Bischoff work for?

Brian Bischoff works for Copprium.

What is Brian Bischoff's role at Copprium?

Brian Bischoff is listed as Founder at Copprium - Conductive Copper Inks at Copprium.

What is Brian Bischoff's email address?

AeroLeads has found 1 work email signal at @k-technologies.com for Brian Bischoff at Copprium.

Where is Brian Bischoff based?

Brian Bischoff is based in Buffalo-Niagara Falls Area, United States, United States while working with Copprium.

What companies has Brian Bischoff worked for?

Brian Bischoff has worked for Copprium, Sumitomo Rubber Usa, Innosek, Buffalo Niagara Manufacturing Alliance, and Buffalo Center For Arts And Technology.

How can I contact Brian Bischoff?

You can use AeroLeads to view verified contact signals for Brian Bischoff at Copprium, including work email, phone, and LinkedIn data when available.

What schools did Brian Bischoff attend?

Brian Bischoff holds Bachelor'S Degree, Engineering from University At Buffalo.

What skills is Brian Bischoff known for?

Brian Bischoff is listed with skills including Product Development, Rapid Prototyping, Manufacturing, 3D Printing, Engineering, Mechanics, Continuous Improvement, and Solidworks.

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