Brook Raymond Email & Phone Number

Research Triangle Park, NC

Integrating various semiconductor device processes including Si, GaAs, InP, GaN and passives for high yield micro transfer printing to host microsystems.

Raleigh-Durham, NC

Developed and continually improved Quality Management System (QMS) to comply with stringent Aerospace AS9100 and ISO9001 standards. Focused on improving Corrective and Preventative Action (CAPA) system, supplier performance monitoring, customer requirements verification, auditing, key metrics and management reviews. Improved product quality for flight.

Durham, North Carolina

Developed next generation NRF2 GaN HEMT devices delivering 20:1 VSWR compliance at 48V operation. Successfully performed and analyzed Highly Accelerated Life Test (HALT) to determine Activation Energy and MTTF estimate for power degradation.Technical Project Team lead with monthly status reviews by the CEO to outsource wafer fabrication processes to west.

Matured GaN on Silicon processes for manufacturability boosting rolled throughput yield from 12 to 65%. Emphasis on PECVD deposition, ICP etch, and electroplating. Improved passivation film stoichiometry and stress control to reduce device leakage current. Improved gate etch endpoint signal intensity to reduce critical dimension variation. Improved up-time.

Roanoke, Virginia Area

Developed high voltage field plate manufacturing controls to improve performance and yield. Developed and qualified wafer level hermetic glassivation process. Led project to qualified multiple substrate suppliers. Saved $3M thru Six Sigma Initiatives in wafer fab.

Roanoke, Virginia Area

Responsible for plasma etch and backside metallization.

Torrance, CA

Ported R&D processes to new 3 inch GaAs pilot production fab. Received Divisional achievement award for qualifying in-house built capless implant anneal process.

Livermore, CA

Responsible for Al/TiW/Ti Plasma etch. Reduced dry metal etch defect density 6X improving yield due reduction of shorts.