David Gomez Email & Phone Number

Chapel Hill, NC, US

Research Triangle Park, NC

Develop the technical strategy for X-Celeprint and lead technical interactions both internally as well as with new and existing customersManage the US team to develop business and complete projects for new and existing customersWork with new customers that have interest to determine how Micro Transfer Printing (MTP) can best help their specific.

Raleigh-Durham, North Carolina Area

Manage all engineering members of the X-Celeprint team across both the US and EU sitesDeveloped employees to allow them to independently manage projects and interact with customersDevelop new business accounts for X-Celeprint as well as lead technical discussionsWork with specific customers to commercialize the technology in a faster mannerDevelop and.

Raleigh-Durham, North Carolina Area

Manage all engineering members of the X-Celeprint team across both the US and EU sitesDeveloped employees to allow them to independently manage projects and interact with customersDevelop new business accounts for X-Celeprint as well as lead technical discussionsWork with specific customers to commercialize the technology in a faster mannerDevelop and.

Raleigh-Durham, North Carolina Area

Developed the print process at both the US and Irish site. Trained new print engineers and scientist to allow them to be proficient at printingProvided technical feedback and guidance for current and new projectsParticipated in customer meetings and worked to develop statement of work (SOW) plans as well as development of costing to achieve specific SOW.

 Development of transfer print process that was able to transfer MEMs chips at a low yield to a process that is able to transfer at transfer yield of 99.9% with the use of DOEs to understand process tolerances and opportunities.. Manage multiple transfer printing programs, specifically scheduling tool time and appropriate resources to effectively use the.

 Manage a group of 12 process and equipment engineers to reduce cost, increase cycle time and qualify tools for new 80nm technology node.  Monitor spending associated with litho tools to ensure the group stays within budget.  Mentor engineers and provide technical guidance to drive the direction of the group. Conduct regular reviews with engineers.

 Responsible for various 193nm and 248nm layers for the 200mm factory. Work to resolve issues and improve performance. Responsible for New Product Introduction Coordination in the 200mm factory. Created procedures to ensure that all activities were completed in a timely manner for the litho area, and worked with a factory wide team to standardize a.

 Project leader for the implementation of Advanced Process Control (APC) in photo. Responsible for recalculation and validation of photo critical dimension limits, equipment testing, and PROMIS wafer flow changes to accommodate APC system. Responsible for maintaining and improving the Canon stepper, TEL and SVG track i-line photo equipment tool sets..

 Project leader of Equipment Automation and PROMIS conversion teams. Managed 14 engineers through conversions for their respective areas to new factory control system.  Developed a project plan including a statement of work, risk analysis, and project timelines for each team. CIM system implementation speed was benchmark for Motorola, with benchmark.

 Responsible for maintaining and improving the Canon stepper process.  MOS-11 representative to the APC Technical Advisory Board (TAB) which developed the direction of photo APC software for Motorola.  Project leader of equipment automation team responsible for automation of Canon steppers, SVG tracks, and TEL tracks.

 Primary owner of WJ CVD and SVG furnace equipment sets. Implemented WJ TEOS process in MOS-11 for shallow trench isolation.  Primary owner of the Applied W CVD equipment set. Converted shadow ring W process to full coverage process to double throughput during factory ramp to mitigate the need of purchasing additional equipment.  Member of the RF BiCMOS.