In semiconductor field, I have experience of Product Engineering in TSMC and Technical Development in VIS. My professional scope includes device development, technology development, new technology transfer from IBM and STM, wafer processing, testing, reliability qualification and new product release into production. SiEn / Product Engineering and Technology Transfer, Director (1.7 years, staff x20)2020 -- Present Transfer 40LP technology from STM 1. Host 40LP transfer meeting for TPQV, SRAM, Process, Reliability Qual.2. Project preparation for 28nm (Poly-SiON and HK/MG).3. Host regular yield meeting and establish yield improvement procedure.AMS / Device Engineering and Electrical Test, Director (2 years, staff x10)2017 -- 2020 Transfer technology from IBM in wafer process and device characterization.1. PCM testkey design for 40nm project NTO.2. Coordinate Keysight and TEL and custom build PCM tester.From IBM, transfer and demomstrate device characterization successfully.VIS / TD_PIE Technical Development, Technical Manager (8 years, staffx6)2008 -- 2016 Develop new device and process1. TCAD, testkey design, NTO, device characterization to meet process reliability. 2. Deliver PDK, Design rule (EDR/LDR), device list, SPICE, sample layout.TSMC / Product Engineering, Advanced Project Leader (8 years, staffx2)2000 -- 2008 Job function covered SRAM and Mass-Production yield improvement: Yield analysis, correlation, Failure Analysis, Fab process stability, Customer handling, NTO and New Product Introduction.1. Lead product team and provide total solution to customer. NV, Microsoft, MediaTek, Marvell. 2. N65/N80/N90/C011/C013 baseline yield improvement. 3. Drive new production by enlarging process window and solving Si issue 4. Interact with customer and package house to solve product issue. 5. Trouble-shooting skill, process and product yield improvement. PFA, EFA, SFA, layout tracing, SRAM Bitmap/Vccmin, shmoo