Choon Yee Tan Email & Phone Number

Melaka, Malaysia

Starting Jan’23, I rotate back to my core technical speciality. Now leading a larger team of 20+ engineers and wider technology coverage with the inclusion of Ball Bond process. Scope covers entire Infineon Melaka Wire Bond Process consisting of Power Logic Assembly, Discrete Segment and Sensor Segment.

Melaka, Malacca, Malaysia

• Effective Oct'20, I accepted the job enrichment opportunity to manage Production Process Stability (PPS) and expanded to Process Yield Engineering (PYE), and synergizing both teams as Process Stability (PS) in Nov'20..
• Owns and govern the PLA Escalation Systematic.
• Drives the escalation prior to review with management, taking up the challenge to facilitate the discussion and especially on grey area topics, provides input to the team based on historical experiences from different.
• Key person in driving YA, proactive setting up systematic and follow up. Revamped the yield review to implement the simplified DMAIC concept.
• PLA UPE OneSAP rep, responsible to ensure a fluid and seamless transition.
• Improve analysis efficiency per module ex-PPS function (weekly, daily DDM LRR% by defects).

Melaka, Malaysia

• PLA UPE Wedge Bond Manager
• DPAK yield all time high dark green (top performing module, harvesting the smashed wire improvement)
• Successful DPAK BSC Q1 steep ramp up to meet customer requirements.
• PLA Technical rep for RF Power transfer out to CREE inclusive knowledge transfer, and new product ramp up (yield, RESO functional stability)Manages DPAK 300um wire shear process shift event.
• Collaborates with equipment manufacturer for to develop new features for process improvement DCO and pre-bleed function.
• Coached my engineer to a successful yield CIP completion (LW Incomplete Wire Cut).

Melaka, Malaysia

• PLA UPE Wedge Bond Team Lead
• Responsible as unit process owner and technical lead for PLA wedge wire bond process. Expanded from LPL to include DPAK, SSO8, TOLL, and RF Power.
• Solved DPAK's long term chronic defect, Smashed Wire utilizing set-up improvement procedures and early detection by Advanced Process Control.
• APC further enhancement to enable wedge bond (without close circuit) to detect lifted wire via PSLOPE and STDEVQ methods.
• Successfully stabilized and ramp-up RF Power wire bond requirements (RESO wires).
• Managed Bosch MQP (Cu tape kinked wire topic), supporting customers with the risk assessment data and customer decided for no recall.

Melaka, Malaysia

• Responsible as unit process owner and technical lead for aluminum wire bond process in D2PAK, FullPAK, TO-Leadless packages.
• Monitoring process performance through SPACE (SPC) charts and improve process performance (CPK).
• Driving improvement projects to meet assigned KPI such as yield, quality, machine uptime and quality.
• Perform qualification of new repeat order equipment, transferred used equipment as assigned to meet company’s goal.
• Supporting quality management as a technical member for Failure Analysis Request (FAR) cases, Product Monitoring (PM) failures and customer audits.
• Investigate root cause, develop and implement solutions, and provide dispositions to deviations occurred in the production line including man, machine, method and material topics.