Choon Yee Tan Email & Phone Number

Melaka, Malaysia

Starting Jan’23, I rotate back to my core technical speciality. Now leading a larger team of 20+ engineers and wider technology coverage with the inclusion of Ball Bond process. Scope covers entire Infineon Melaka Wire Bond Process consisting of Power Logic Assembly, Discrete Segment and Sensor Segment.

Melaka, Malacca, Malaysia

Effective Oct'20, I accepted the job enrichment opportunity to manage Production Process Stability (PPS) and expanded to Process Yield Engineering (PYE), and synergizing both teams as Process Stability (PS) in Nov'20. Main key components combined here, PPS drives in terms of quality (eg. maverick lots improvement, Cpk, systematic governances) while PYE drives in terms of yield (eg. best practice sharing, year on year improvements). This position allows a wide spread coverage to support different production areas and processes.During this time period, I offered the opportunity to enroll in the My Leader 2021 talent program.• Owns and govern the PLA Escalation Systematic.• Drives the escalation prior to review with management, taking up the challenge to facilitate the discussion and especially on grey area topics, provides input to the team based on historical experiences from different modules and proactively looking for best solution. Pull in experts from various areas for integration topics (eg. mold flashes).• Key person in driving YA, proactive setting up systematic and follow up. Revamped the yield review to implement the simplified DMAIC concept.• PLA UPE OneSAP rep, responsible to ensure a fluid and seamless transition.• Improve analysis efficiency per module ex-PPS function (weekly, daily DDM LRR% by defects).• Managed and re-prioritize to support for urgent adhoc activities (eg. SA to SII plating conversion)• Manages external communications with out of M1 on the weekly reviews (PLATS, and M3).• Reviewed and provided clear guidelines on the TCN requirements and criteria, driving to 0 overdue TCN.• Proactively gather the BE team (OPC, RP, MEM, LC) with BU for the LPL APV topic causing discrepancy between STD and HD loading.

Melaka, Malaysia

PLA UPE Wedge Bond Manager• DPAK yield all time high dark green (top performing module, harvesting the smashed wire improvement)• Successful DPAK BSC Q1 steep ramp up to meet customer requirements. • PLA Technical rep for RF Power transfer out to CREE inclusive knowledge transfer, and new product ramp up (yield, RESO functional stability)Manages DPAK 300um wire shear process shift event.• Collaborates with equipment manufacturer for to develop new features for process improvement DCO and pre-bleed function.• Coached my engineer to a successful yield CIP completion (LW Incomplete Wire Cut).

Melaka, Malaysia

PLA UPE Wedge Bond Team Lead• Responsible as unit process owner and technical lead for PLA wedge wire bond process. Expanded from LPL to include DPAK, SSO8, TOLL, and RF Power.• Solved DPAK's long term chronic defect, Smashed Wire utilizing set-up improvement procedures and early detection by Advanced Process Control.• APC further enhancement to enable wedge bond (without close circuit) to detect lifted wire via PSLOPE and STDEVQ methods.• Successfully stabilized and ramp-up RF Power wire bond requirements (RESO wires).• Managed Bosch MQP (Cu tape kinked wire topic), supporting customers with the risk assessment data and customer decided for no recall.• Build up resources pipeline for my team, for load balancing of tasks.• Successfully build up the team of young entry engineers to key engineers.

Melaka, Malaysia

• Responsible as unit process owner and technical lead for aluminum wire bond process in D2PAK, FullPAK, TO-Leadless packages.• Monitoring process performance through SPACE (SPC) charts and improve process performance (CPK).• Driving improvement projects to meet assigned KPI such as yield, quality, machine uptime and quality.• Perform qualification of new repeat order equipment, transferred used equipment as assigned to meet company’s goal.• Supporting quality management as a technical member for Failure Analysis Request (FAR) cases, Product Monitoring (PM) failures and customer audits.• Investigate root cause, develop and implement solutions, and provide dispositions to deviations occurred in the production line including man, machine, method and material topics.• Regular review and update of documentations such as Process Specification, FMEA, OJTI and Process Flow to reflect current practice. • Core team member for quality improvement programs such as Quality First Task Force (QFTF) and Next Level of Zero Defect (NLoZD).• Drive Broken Wire improvement project (5PPM to 1PPM) via various improvements such as machine modification, material change, tool life span, looping parameter optimization and auxiliary parameter definition.• Start-up team member for IFX-Bosch subcon wire bond activities such as platform and machine qualification, enhancing wire bond process robustness to meet Bosch requirements.• Productivity improvement of wire bonding by reducing need of device conversion by consolidating bonding diagrams of similar devices thus reducing scheduled downtime and easing planning activity.