Charles Lin

Charles Lin Email and Phone Number

Senior Application Manager at Bruker Nano Surfaces & Metrology @ Bruker Nano Surfaces & Metrology
santa barbara, california, united states
Charles Lin's Location
Hsinchu City, Taiwan, Taiwan, Taiwan, Province of China
Charles Lin's Contact Details

Charles Lin personal email

n/a
About Charles Lin

1. 20+ years semiconductor industrial experience in pre-sale, business development, product marketing and failure analysis, also new application and new workflow penetration with proven track record in Lab & Fab applications significantly.2. Understanding of customer requirement and technical challenge, strong leadership, communication, customer facing and problem solving skill.3. Experienced to lead the applications team support different product and region in China, TW, SEA and Japan, ability to manage cross product and region. 4. Skills:Business development; Leadership; Communication; Pre-sale & marketing strategic ; Yield enhancement; Failure analysis & quality control; problem solving; New workflow implementation; FIB/SEM/TEM application; Ebeam inspection & review; Defect inspection; X-ray inspection & metrology; AFM metrology & mask repair; NBD strain analysis, AAFM EUV mask repair.

Charles Lin's Current Company Details
Bruker Nano Surfaces & Metrology

Bruker Nano Surfaces & Metrology

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Senior Application Manager at Bruker Nano Surfaces & Metrology
santa barbara, california, united states
Employees:
222
Charles Lin Work Experience Details
  • Bruker Nano Surfaces & Metrology
    Senior Application Manager
    Bruker Nano Surfaces & Metrology Aug 2021 - Present
    Taiwan
    Pre-sale & manage apps team for TW SEMI customers1. Manage Apps team support based on pre-sale, project and develop priority with sales team and HQ, focus on business growth activity. 2. Manage the CIP project to meet customer exception, include XRD inspection & XRD/XRR/XRF metrology in RD, HVM and advance packaging Fab, especially AAFM EUV mask repair released CIP to address next generation demand.3. Implement new XRD metrology in advance node GAA/NS structure, provide concentration and thickness direct measurement without scrapped wafer. 4. Coordinate with the service team to support the system installation, SAT sign-off, customer satisfaction, parts storage and delivery, also service escalation call and GTS support.
  • Applied Materials
    Senior Application Manager
    Applied Materials Apr 2020 - Jul 2021
    Taiwan
    Manage apps team dedicated to TSMC1. Manage ebeam review & inspection Apps team, arrange the support based on RD TV priority and key projects with sales team and HQ, focus on tool penetration and HVM CIP activity. 2. Completed work with YED group to adopt new ebeam review & inspection system for advance node in RD group and proliferate to HVM production Fab.3. Coordinate with the service team to support the system installation, and support SAT for system sign-off, especially tool issue escalation and new tools evaluation.
  • 賽默飛世爾
    Senior Application Manager, Gi Bu Elec Sal&Bus Dev Field Apps Asia
    賽默飛世爾 Aug 2016 - Mar 2020
    Taiwan
    1. Lead the Applications Team for APR Electronics customer2. Manage the applications activity and support for customer.3. Sales support for new technology Impartment.4. Business develop & Marketing support.5. Involve product pre-sale & marketing presentation, bridge the gap to help business growth in China, TW, SEA & Japan, especially inline water level TEM workflow implementation, big success implement new inverted sample prep workflow for ultra-thin TEM sample include wafer level TEM workflow.6. Experienced to lead the applications team support different product and region in China, TW, SEA and Japan, ability to manage cross product and region, help the apps engineer build their expertise and long-term growth, apps team contribution have been recognized by customer and HQ. 7. Promote the next Gen tool and extend more business in current and new customers.8. Arrange TRM/QRM with customer call plan, understand the leading-edge technology challenge, help product line to develop right applications for customer demand.
  • Fei Company
    Senior Application Manager, Gi Bu Elec Sal&Bus Dev Field Apps Asia
    Fei Company Apr 2014 - Mar 2020
    Taiwan
    1. Lead the Applications Team for APR Electronics customer2. Manage the applications activity and support for customer.3. Sales support for new technology Impartment.4. Business develop & Marketing support.
  • Fei Company
    Apr Application Team Leader
    Fei Company Nov 2011 - Mar 2014
    Apr/Taiwan
    1. Lead the SEM/SDB/WDB/TEM Applications Team for APR Electronics customer2. Manage the applications activity and support for customer.3. Sales support for new technology Impartment.4. Marketing support.
  • Fei Company
    Sr. Application Engineer
    Fei Company Mar 2004 - Oct 2011
    >WDB sales/demo support>WDB product marketing>WDB new application support>TEM_NBD strain analysis application support>FIB/SEM application>TEM sample preparation
  • Applied Materials
    Sr. Application Engineer
    Applied Materials Mar 2000 - Mar 2004
    >1st 300mm production polit run support>New Inspection tool technology implementation>Review SEM applications

Charles Lin Skills

Tem Materials Science Thin Films Nanotechnology Fib Edx Semiconductors Metrology Electron Microscopy Scanning Electron Microscopy Failure Analysis Characterization Design Of Experiments Optics Mems Semiconductor Industry Ic Physics Sensors

Charles Lin Education Details

Frequently Asked Questions about Charles Lin

What company does Charles Lin work for?

Charles Lin works for Bruker Nano Surfaces & Metrology

What is Charles Lin's role at the current company?

Charles Lin's current role is Senior Application Manager at Bruker Nano Surfaces & Metrology.

What is Charles Lin's email address?

Charles Lin's email address is cl****@****ico.com

What schools did Charles Lin attend?

Charles Lin attended National Tsing Hua University.

What skills is Charles Lin known for?

Charles Lin has skills like Tem, Materials Science, Thin Films, Nanotechnology, Fib, Edx, Semiconductors, Metrology, Electron Microscopy, Scanning Electron Microscopy, Failure Analysis, Characterization.

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