Current role: Managing a small team developing the electrical hardware for the next generation of Amazon products. Previous roles:Technical Lead for Amazon's Dash Smart Shelf. Essentially from concept to prototype to production of a V1 product. Lead a cross-functional deep dive into the sensors, the core of the product, to improve the performance of existing tech to meet the customer requirements. We were able to improve the performance of off the shelf technologies to meet our needs without adding excessive cost, working with multiple partners for their given expertise to move the state of the shelf a little further. System lead for Echo Auto device and power adapter from DVT to MP. Troubleshot multiple design and supplier issues in support of ramp to production. Owned the ERS for the 12V DC power supply for the automotive application. The Technical Advisory Group (part of Amazon Advanced Products & Technologies) is responsible for investigating and incubating new (V1) product concepts. We translate high-level and often ambiguous product requirements into reality and advise business leaders across Amazon how best to deliver disruptive products to market to meet customer needs. The range of technologies and concept reflects the breadth of Amazon's current business portfolio and future aspirations.

As the first non-founding engineer on the team, I touched many parts of the product and company and reported to the CEO. My primary responsibility was for EE HW development at Sensel, including the electronics for their V1 product, the Morph. The product included a proprietary and revolutionary touch and pressure sensor technology, "Pressure Grid." I also developed multiple prototypes and test boards. Beyond that, I led the search and selection of the contract manufacturer for the Morph. This included initial conversations and evaluation process. I wrote the RFP and led MSA negotiations with the selected CM. I also led search and selection process for customer fulfilment for the Morph product. I was the primary point of contact for both the CM and 3PL partner's management and many parts of their operations. In these pursuits I engaged consultants to aid and advise on project management and manufacturing operations, learning heavily from said consultants. We developed the V1 launch plan for the product and tracked the schedule to understand risk and coordinate material purchases, as well as understand impact of design changes on the schedule to report out to Sensel’s management.I managed multiple parts of the supply chain, including ICs & semiconductors, PCB –both local and abroad-, Li-Po batteries, packaging and cables. I led their regulatory testing and compliance for the Morph.I set up some fairly routine processes (for myself to follow) and I selected and set up their PLM system, and switched them over to an industry standard EE CAD package, enabling the outsourcing of layout. I saw many parts of the business operations of a startup, such as PO systems and invoicing. I helped represent Sensel at multiple conferences, engaging directly with customers.

Developed and evaluated technologies and prototypes for proposed V1 products as part of a small cross functional group. The group was responsible for generation of said V1 product proposals, via generation and evaluation of new concepts and experiences. Had the opportunity to work closely with very bright UX folks.

I worked in a group focused on small/medium business printers. I took over some responsibility of a retiring engineer, including ownership of our division's fax solution hardware. This included managing BOMs, troubleshooting and addressing EMC and telcom regulatory issues and support during ramp to manufacturing. I interfaced multiple teams across HP as well as external partners.I co-developed the architecture for an accessory product during early development stages. I worked with multiple teams, mechanical, electrical, safety and regulatory, and firmware, to implement the design. The design included multiple mix-signal power and motor control ASICs, as well as an FPGA. I performed schematic entry using Cadence Design Authoring and oversaw layout performed by a layout engineer using Allegro PCB. I owned engineering responsibility for multiple printer "motherboards" during early prototype phases with attention to DFM/DFA/DFx. The designs consisted of thousands of nets and hundreds of components, PCI-e interfaces, SPI, I2C, LVDS, custom buses, digital asics in BGA packages, mix signal asics, analog sensors and signals and many connectors. I performed schematic entry, tracked change requests from other teams, and work closely with a layout engineer to do the layout.

I worked in a group focused on small/medium business printers. I was responsible for characterizing switch mode power supplies and some signal integrity characterization for one program, as well as owning schematics and layout for small boards throughout the product.I did multiple projects, one including a spartan 6 FPGA and included writing verilog RTL and interfacing with FW engineers to develop test suites. Another involved a device to assist in the characterization of power supplies. I acted as team lead among a team of 3 other engineering students. The project used an Atmel ATMEGA microprocessor, delta-sigma analog to digital converters and digital to analog converters utilizing SPI and I2C. I assisted in some of the coding for the project as well, both in C and VB.net.

Job during community college.

Job during high school.