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Chenchen Liu Email & Phone Number

R&D Hardware Engineer at Broadcom Inc. at Broadcom Inc.
Location: San Francisco Bay Area, United States 7 work roles 3 schools
2 work emails found @broadcom.com 2 phones found area 215 LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 100%

Contact Signals · 2 work emails · 2 phones

Work email c****@broadcom.com
Direct phone (215) ***-****
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Current company
Role
R&D Hardware Engineer at Broadcom Inc.
Location
San Francisco Bay Area, United States
Company size

Who is Chenchen Liu? Overview

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Quick answer

Chenchen Liu is listed as R&D Hardware Engineer at Broadcom Inc. at Broadcom Inc., a with 57414 employees, based in San Francisco Bay Area, United States. AeroLeads shows a work email signal at broadcom.com, phone signal with area code 215, and a matched LinkedIn profile for Chenchen Liu.

Chenchen Liu previously worked as R&D Hardware Engineer at Broadcom Inc. and Research Assistant at University Of Pennsylvania. Chenchen Liu holds Doctor Of Philosophy (Ph.D.), Mechanical Engineering And Applied Mechanics from University Of Pennsylvania.

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Email format at Broadcom Inc.

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*@broadcom.com
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Profile bio

About Chenchen Liu

-Solid background in multiphysics (thermal, mechanical, acoustic, RF) finite element analysis (FEA)-Strong skills in Java based FEA software COMSOL and C++ based open-source software deal.II -Research experience in multiscale numerical methods, Intel MKL, and HPC with MPI-Proficient with commercial software: COMSOL, Matlab, ABAQUS, ANSYS, HFSS, ADS, Cadence-Excellent communication and problem solving skills, self-motivated, quick learner, good team player

Listed skills include Finite Element Analysis, Simulations, Numerical Analysis, Matlab, and 8 others.

Current workplace

Chenchen Liu's current company

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Broadcom Inc.
Broadcom Inc.
R&D Hardware Engineer at Broadcom Inc.
California, United States
Website
Employees
57414
AeroLeads page
7 roles

Chenchen Liu work experience

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R&D Hardware Engineer

Current

Palo Alto, California, Us

Multiphysics (thermal, mechanical, acoustic, and RF) finite element simulations (FEA) on Bulk Acoustic Wave (BAW) devices, including model generation, automation, and maintenance of codes.Advanced application of numerical methods (C, Java, Matlab) in FEM modeling and automation of RF tests and measurements with Python.

Aug 2018 - Present

Research Assistant

Philadelphia, Pa, Us

I. Multiscale and Multiphysics finite element modeling and simulation of mechanical and acoustic metamaterials.• Established a coarse-graining framework for dynamic homogenization in spirit of FE2 method with explicit/implicit Newmark method for time domain discretization.• Implemented the multiscale solver in MATLAB and DEAL.II (C++ based open-source software) for 2-D and 3-D heterogeneous structure. • Operated the open-source software in Linux environment; Enabled the multi-scale solver to run in parallel with MPI. Conducted the version control of the software development with Git; Post-processed the visualization with ParaView and Gnuplot; Compared the results with COMSOL and Abaqus.• Conducted modal analysis and analyzed the exotic properties of acoustic metamaterials composed of hard particle (Pb, steel) coated with soft elastomer embedded in epoxy matrix which has promising application in noise cancellation and vibration control.• Proved Hill's averaging theorem under finite element discretization, which was certified with a simulation of a highly inhomogeneous microstructure under large deformation by COMSOL.• Currently collaborating with experimental group of Prof. Raney (Penn) to manufacture and test the above designs with 3D printing.II. Broadband Acoustic Metamaterial with Hierarchical Architecture.• Designed a broadband acoustic meta-structure with optimized hierarchical microstructure.• Calculated the bandgap by equivalent spring-mass models and continuum model.• Simulated the transmission loss in COMSOL Frequency Domain.

Aug 2013 - Jul 2018

Graduate Teaching Assistant

Philadelphia, Pa, Us

Finite Element Method and its Applications (MEAM527/ENM427)• Led two recitations per week to class of 25 graduate students giving hands-on tutorials of COMSOL Multiphysics.• Nominated as the Outstanding Teaching Assistant in the Department of Mechanical Engineering & Applied Mechanics by Prof. Nikolaos Aravas.Topics in Computational Science and Engineering (ENM540)• Conducted hands-on tutorials of writing and running input file in ABAQUS.

Aug 2014 - Dec 2015

Research Intern, Nomad Research Institute

Albuquerque, Nm, Us

Emergent homogenization techniques and effective dynamical properties.• Analyzed the procedure for selecting statistical and representative volume element (SVE and RVE, respectively) size for additively manufactured steels investigated at SNL.• Generated SVE and RVE through the exploration of statistical descriptors (n-point correlation functions). • Enabled structure-property correlation analysis (stress-strain evolution) by testing the effect of different RVE configurations on the static and dynamic macroscale response using the quasi-explicit multiscale solver written in C++.

Jun 2016 - Jul 2016

Research Assistant

西安, Shaanxi, Cn

Size-dependent properties of smart materials and structures.• Theoretically incorporated the effect of flexoelectricity on the electric potential distribution in a bent ZnO nanowire, which could fill the gap between experiment and theoretical results based on piezoelectricity.• Analyzed the acoustic dispersion properties of periodic structures with transfer matrix method.• Investigated the strain gradient effect on the band gap structures of non-piezoelectric materials (BaTiO3-SrTiO3 two-layered structure).

Aug 2010 - Jul 2013

Exchange Student

Hsinchu, Taiwan, Tw

• Selected to be an exchange student in National Chiao Tung University.• Studied in the Application of Thermal and Fluid Lab, supervised by Prof. Wu-Shung Fu, Department of Mechanical Engineering.• Won the 3rd Place of Creative Poster Design Contest.• Won the Winner of Creative Writing Contest.

Aug 2009 - Feb 2010
Team & coworkers

Colleagues at Broadcom Inc.

Other employees you can reach at broadcom.com. View company contacts for 57414 employees →

3 education records

Chenchen Liu education

Doctor Of Philosophy (Ph.D.), Mechanical Engineering And Applied Mechanics

University Of Pennsylvania

Master'S Degree, Solid Mechanics

Xi'An Jiaotong University

Bachelor'S Degree, Engineering Mechanics

Xi'An Jiaotong University
FAQ

Frequently asked questions about Chenchen Liu

Quick answers generated from the profile data available on this page.

What company does Chenchen Liu work for?

Chenchen Liu works for Broadcom Inc..

What is Chenchen Liu's role at Broadcom Inc.?

Chenchen Liu is listed as R&D Hardware Engineer at Broadcom Inc. at Broadcom Inc..

What is Chenchen Liu's email address?

AeroLeads has found 2 work email signals at @broadcom.com for Chenchen Liu at Broadcom Inc..

What is Chenchen Liu's phone number?

AeroLeads has found 2 phone signal(s) with area code 215 for Chenchen Liu at Broadcom Inc..

Where is Chenchen Liu based?

Chenchen Liu is based in San Francisco Bay Area, United States while working with Broadcom Inc..

What companies has Chenchen Liu worked for?

Chenchen Liu has worked for Broadcom Inc., University Of Pennsylvania, Sandia National Laboratories, Xi'An Jiaotong University, and National Chiao Tung University.

Who are Chenchen Liu's colleagues at Broadcom Inc.?

Chenchen Liu's colleagues at Broadcom Inc. include Yanru Cai, Widjaja Sangtoki, Vikas Shitole, Jayapala P M, and Mahrokh Esfandiary.

How can I contact Chenchen Liu?

You can use AeroLeads to view verified contact signals for Chenchen Liu at Broadcom Inc., including work email, phone, and LinkedIn data when available.

What schools did Chenchen Liu attend?

Chenchen Liu holds Doctor Of Philosophy (Ph.D.), Mechanical Engineering And Applied Mechanics from University Of Pennsylvania.

What skills is Chenchen Liu known for?

Chenchen Liu is listed with skills including Finite Element Analysis, Simulations, Numerical Analysis, Matlab, Engineering, C++, Comsol, and Ansys.

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