I joined OpenAeros as one of the 1st engineers and am looking forward to working toward a safer future with regards to aerosol mitigation and monitoring. I primarily handle day to day design requirements for concepts with the goal of future productization. This involves 3D modeling (Solidworks, Ansys SpaceClaim, 3D scanners, 3D printing (SLA, FDM, etc.), Rapid Prototyping, Maching (3-axis precision milling), LSR injection molding, concept-to-completion, reverse engineering, research, testing, validation and verification, and many other things vital to completing the overall goals of the company.

As a mechanical engineer at Automated Assembly I was part of a tight knit group of engineers that designed and implemented automation solutions for the various production lines within the company. This was an extremely fast paced concept-to-completion environment that offered many daily challenges to overcome. I was in charge of 1 of the 5 production lines which produced RFID tags for toll stations used in the USA and around the world. This line involved many robots (3,4,and 6 axis) doing complex pick and place operations, solder and adhesive dispense, solder flowing, label application, antennae writing (non wet process), UV laser etchers, etc. I was also quite fortunate to have a Hurco VMX42 available to me onsite. This allowed me to machine my own parts from my designs with out the lead times typical of sending parts and assemblies to a machine shop. This is an extremely valuable skill to have as an engineer and it taught me so much more than I could have learned simply by designing parts and sending them out. A valuable lesson I learned in my time at Automated Assembly with regards to design and machining is "Just because you can ...doesn't mean you should". I have taken to that philosophy and it has greatly improved my design and implementaion skills beyond what a normal engineer might experience.Specific skills and attributes:-Very proficient in most CAD packages (2D and 3D) with Soldiworks and Autodesk Inventor being the big two-Very proficient with CAM packages including Fusion 360 and SolidCAM-Very proficient with 3-axis milling machines from small to extremely large-DFM (design for manufacturing) -Concept to completion -Some FEA simulation-Extremely proficient with electro-mechanical design, assembly, troubleshooting, wiring, testing, process development, data collection, communications, working closely with my team to finish projects in a timely manner

While at Seagate I was an integral part of the HGA (Head Gimbal Assembly) team. As a Mechanical Designer I was primarily involved in working closely with my team of engineers to bring machine design concepts and automation into existence. This involved using various CAD packages to fully flesh out assemblies and various machine design needs. I worked diligently with local and national machine shops, component vendors, chemical companies, etc. in order to fulfill design requirements for various machine and automation design so that it could be matured through maturity gates before being transfered overseas for installation and production use. This role was quite challenging for a litany of reasons and I enjoyed overcoming these with my experience as a mechanical designer. My time at Seagate was amazing and I learned so much while there.

Assembling, testing, and troubleshooting complex electromechanical systems for the use mainly in the Semiconductor, Pharmaceutical, and Aerosol industries.Field service is another part of my job at MSP Corporation. I travel throughout the world doing various installs, preventative maintenance, and repair work for companies like Intel, Hitachi, ST Micro, Sony, and many other major industry players.The experience I have gained from this aspect of my job is invaluable.-Depositing nano-particles on subtrates such as Silicon Wafers, Photomasks, HDD, Glass Wafers using our Next Generation Particle Deposition System to create calibration standards. These standards are used to calibrate various defect scanners such as KLA-Tencor SP2.-Produce and test Process Particle Suspensions used by the Semiconductor industry to create internal calibration standards.-Helped design and assemble the first few Humidified Tandem Dynamic Mobility Analyzers (HTDMA) that are now being tested and used in Hong Kong for atmospheric deliquescence analysis.