Manage sourcing strategy for new products from C&F thru high volume production. Create bottom-up material cost targets for new products.Produce buy level part cost allocations and a sourcing strategy to achieve the cost targets.Perform deep dive analysis of material sourcing data looking for problems and opportunities for improvement to cost and delivery.Develop methodologies and tools for sourcing data analysis. Create and maintain multiple Excel templates with VBA macros that standardized methodologies and reduced data acquisition durations from days to less than an hour.Regularly report on product cost performance to senior management and other key stakeholders, define and drive cost reduction roadmap to meet cost targets.Form and lead cross-functional teams with Supply Chain, Operations, Engineering and other members to define sourcing strategies for new products.Perform should cost analysis of outsourced assemblies, drive suppliers to improve cost and delivery, recognize opportunities to improve product design for cost, quality and delivery.

Technical content expert for 193nm immersion nanolithography systems (scanners).Technical expert for wafer process tools including detailed knowledge of high resolution optics, motion control systems, robotic handling systems, high voltage electronics, fluid control systems, Class 4 lasers and distributed control systems.Lead teams of Intel and supplier engineers troubleshooting equipment failures and managing tool repairs. This included supplier team members in Asia and Europe.Create VBA macros and SQL queries to analyze tool and product performance data. Utilize statistical based process control, predictive maintenance and model-based troubleshooting to maximize equipment availability, product quality, cost of ownership and tool to tool matching. Generate weekly performance reports for fab management. Create coherent procedures for engineers and technicians.

Technical supply chain manager responsible for Intel’s long-term supplier roadmap for nanolithography metrology (CD and overlay metrology).Ensure capital equipment suppliers are aligned with Intel’s technical, cost and schedule requirements. Manage suppliers in the US, Asia, Europe and the Middle East.Own the technical contracts (PSpec) for managed capital equipment.Supported CIP programs for current equipment users in high volume factories.Define supplier test plans for source inspection and equipment performance validation.Drive suppliers and internal stakeholders to deliver required information and decisions.Perform cost analysis and work with internal stakeholders to determine cost targets for new capital equipment and upgrades.

Manage performance and availability for 193nm and 248nm microlithography systems. Analyzed system performance and operations to make continuous improvements to tool availability. Trained and mentored technicians and new engineers in processes and procedures.Created and presented training material on optical lithography theory, operations, Intel monitors and Cymer excimer laser theory. Monitored laser health for all D1C excimer laser systems. Created VBA tools for trending laser performance and maintaining laser configuration.Oversaw installation and qualification of microlithography systems including overseeing creation of facilities design packages, managing trades and supplier installation resources.

Executed proof-of-concept, feasibility and lifetime studies on excimer laser products.Conducted C&F and lifetime studies for cost of operation upgrades.Transitioned new products from C&F to manufacturing, drove final development of performance upgrade packages and specialty excimer lasers for external customers.Conducted customer acceptance tests on new products; traveled to customer sites for beta installs.Developed novel methods for laser optimization, improving products and increasing margins.Generated test reports, technical memos and presentations for customers and Cymer employees; regularly presented test data to Cymer senior management.