Chris Solis Email & Phone Number

• Job included Process development and sustaining support for solder paste print, high speed component pick and place, flip chip pick and place, reflow, under fill, clean process, hybrid de-paneling and wafer saw..
• A key player in growing the SMA area from one production line with one product up to five production lines and 20+ products.
• Provided leadership and training to production personnel across 24/7 operation with minimal supervision.
• Worked closely with production to implement lean and ergonomic concepts in the work area.
• A key player with planning and training of the technicians to match solder paste printers, solder paste inspections systems and routers to enable standard programs across all production lines to provide greater.
• Matched flip chip placement systems to enable standard programs across all production lines to reduce process variation and setup times..

• Provided leadership in setting up an automated ball attach process at a startup company. Attended trade shows to showcase the companies Ball Grid Array technologies.
• Characterized and implemented an Automated Ball Attach line capable of 10,080 UPH that was in-line with a reflow and cleaning process.
• Worked closely with out of town equipment vendors on design of automated handling equipment.
• Supervised two operators and one process/equipment technician.

3 Years at Research Group: Worked closely with teams on materials research. Materials included mold, die attach and underfill material. Was responsible executing DOE’s and provide detailed results to the teams. Utilized wafer saws, die attach machines, pick and place equipment, solder printers, ball attach machines, ultrasonic machines and many other.