Chris Solis Email & Phone Number

Job included Process development and sustaining support for solder paste print, high speed component pick and place, flip chip pick and place, reflow, under fill, clean process, hybrid de-paneling and wafer saw. Generated specifications and reports for operations, maintenance, procurement and the design group. Provided solder attach, component placement and underfill design review for new hybrid circuit designs. Programmed equipment and oversaw new product development builds for process qualifications and validations.• A key player in growing the SMA area from one production line with one product up to five production lines and 20+ products.• Provided leadership and training to production personnel across 24/7 operation with minimal supervision.• Worked closely with production to implement lean and ergonomic concepts in the work area.• A key player with planning and training of the technicians to match solder paste printers, solder paste inspections systems and routers to enable standard programs across all production lines to provide greater flexibility, improved quality and reduced costs.• Matched flip chip placement systems to enable standard programs across all production lines to reduce process variation and setup times.. • Characterized, and validated incoming SMT equipment.• Built 90+% of proto type builds for four years. Was a key player in enabling the assembly of challenging projects that enabled Medtronic to create proof of concept hybrids that then accelerated product to market.

Provided leadership in setting up an automated ball attach process at a startup company. Attended trade shows to showcase the companies Ball Grid Array technologies.• Characterized and implemented an Automated Ball Attach line capable of 10,080 UPH that was in-line with a reflow and cleaning process.• Worked closely with out of town equipment vendors on design of automated handling equipment.• Supervised two operators and one process/equipment technician.

3 Years at Research Group: Worked closely with teams on materials research. Materials included mold, die attach and underfill material. Was responsible executing DOE’s and provide detailed results to the teams. Utilized wafer saws, die attach machines, pick and place equipment, solder printers, ball attach machines, ultrasonic machines and many other analytical equipment.3 Years at QFP Packaging Pilot line: As maintenance technician, was responsible for an area which included mold presses, dam bar presses, testers, lead/tin platters, singulation presses and lead form machines. Was directly responsible for increasing the yield 3% on the lead form process thus saving the group approximately $420,000 per year. Helped support an 24/7 operation with minimal supervision.6 Years at Aerospace Group: Worked in the QA department and was responsible to make sure that flight hardware met the outgoing specifications. Operated high frequency automated test equipment while monitoring flight hardware through vibration and environmental testing. Worked on an off-shift with minimal supervision and took leadership in training all incoming technicians on the shift. Assisted in the transportation of hardware to the vendor.