Christopher Flores Email and Phone Number
Christopher Flores work email
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Christopher Flores personal email
24 years working experience in FOL semiconductor company
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Lead I Product ImplamentationUst Malaysia Mar 2022 - PresentPenang, MalaysiaHandling all product 200G/400G/800G/SR8/DR8 SBR lot for the feature products of the company and focus on addressing any issues (Man, Machine, Material and Method) or the environment that was previously identified in the (RCA) root cause analysis line problems to improve yield, to reduce lot rejection rate, to resolve lots having problems -
Associate Engineer Ii - Fol WirebondCoherent Corp. Feb 2010 - Mar 2022MalaysiaAs of associate engineer, conduct Design of Experiments (DOE) to analyze line problems to improve yield, to reduce lot rejection rate, to resolve lots having problems. Performed both minor and major machine repair, troubleshooting, system rehabilitation and recovery to maximize equipment utilization and production output. Coordinate with Process engineer/maintenance for qualification of incoming/new equipments, responsible for maintaining 100% efficiency, up - time and utilization of FOL equipment for production support. For daily equipment downtime/uptime reports, technical interface with process engineer, production supervisor, quality control personnel and field service engineer to support production operations. Review specific standard process flow, production specifications, conditions, and parameters updates of equipments handled. Team coordinator for Front of Line production operations with assigned task of planning and executing customer lot movements to meet target manufacturing cycle time, on time delivery (OTD) and high assembly yield22 years solid experience in FOL WirebondSpecial skills:SPCFMEA8D5S + 1 WPO5 Why’s7 QC toolsJMPLean CaptainTRAINING AND SEMINARS ATTENDEDLean CaptainDATACON 2200 evo process trainingConducted at FINISAR MALAYSIA -
Process Engineer (Wirebond)Stats Chippac Jan 2007 - Feb 2009MalaysiaAchievements:* Yield improvement at BCC line Awardee STJ & Qualcomm devices.* Awarded (Successfully pulled ahead the 0.8mils gold wire conversion for Connexant to meet the customer requirement as well as achieving a monthly cost saving of USD18.2k (Total cost saving to date USD 50k)* Awarded of successful implement the wires relax tolerance cost saving project for 1.0mil wire since WW34 2007 with no quality issue. (Cost saving per month USD 28k, annual Cost Saving USD 336k, Cost saving to date USD 259k)* Promoted from Assistant Engineer to Engineer -
Process Technician IiAmkor Technology Dec 1997 - Oct 2007Sta. RosaAchievements:* Shift Wire bond yield 99.86 % Extra Mile Awardee.* Improve performance of a non-performing shift.* Evaluated the capillary life of a rejuvenated capillary, the study will be used as a basis using a rejuvenate capillary at Wirebond.* Consistently the highest output giver at Wirebond.* Obtained the highest output in a shift.* Quarterly Triple Zero Quality 2x Awardee.* Qualify Fine pitch capability on Wirebond machine.* Customer Focus Team Extra Mile Awardee.* Qualification capability on ESEC3008 machines in PBGA Wirebond line station.* Qualification AGILENT Devices on ESEC3008 machine.* Trained Line sustaining Process Engineer & Technician how to set – up, optimized bond parameters and others at ESEC 3008 machine on PBGA station.* Qualification capability on ESEC3008 machines in PBGA Wirebond line station.TRAINING AND SEMINARS ATTENDED7 QC ToolsFailure Mode & Effect Analysis (FMEA)5S + 1 WPOCycle Time APQPRoot Cause Analysis (RCA)6 Big LossesCode of DisciplineTotal Productive Maintenance (TPM) Wirebond Output ResponseEffective Business CommunicationISO 14001 Orientation Robust Process Set-up Assessment CourseEMS Specs Awareness Electronic Component & TroubleshootingConducted at AMKOR TECHNOLOGY PHILS site 3 Bonding Wire Handling Seminar Conducted at HERAEUS ELECTRONIC MAT’L PHILS INC. Testing Plasma Treated MaterialsPlasma Basic Machine Operation Conducted at AMKOR TECHNOLOGY PHILS site 3ESEC 3008 Advance Wirebond Level 2 Training Loop Mode 1ESEC 3008 Advance Wirebond Set-up and for Mechanical Set-up Workshop Operation trainingESEC 3008 Advance Wirebond Process training ESEC 3008 Trouble Shooting TechniquesConducted at AMKOR TECHNOLOGY PHILS site 3Step 2 K&S 1488 Trouble Shooting TechniquesK&S 1488 Advance Wirebond training for Process WorkshopK&S 8028 Trouble Shooting TechniquesConducted at AMKOR TECHNOLOGY PHILS site 3
Christopher Flores Skills
Christopher Flores Education Details
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Ieti AlabangElectronics
Frequently Asked Questions about Christopher Flores
What company does Christopher Flores work for?
Christopher Flores works for Ust Malaysia
What is Christopher Flores's role at the current company?
Christopher Flores's current role is Lead I Product Implamentation (Photonics, Optical Sub Assembly FOL Wirebond).
What is Christopher Flores's email address?
Christopher Flores's email address is ch****@****sar.com
What schools did Christopher Flores attend?
Christopher Flores attended Ieti Alabang.
What skills is Christopher Flores known for?
Christopher Flores has skills like Electronics, Semiconductors, Ic, Failure Analysis, Fmea, Process Engineering, Manufacturing, Engineering, Spc, Design Of Experiments, Materials, Process Control.
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CHRISTOPHER FLORES
Atlanta, Ga3elauwit.com, dcflores.com, alliedtelecom.net4 +120254XXXXX
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Christopher Flores
Talent Acquisition Partner @ Trinity Health At Home | Hiring, HrPhiladelphia, Pa1trinity-health.org -
Christopher Flores
Strategic Business Management | B2B Development | Sales & Marketing | Finance ManagementMetro Manila1hotmail.com -
Christopher Flores
Director Data Scientist At Usaa | Board Of Advisors Science, Engineering, Tech., (Set) At St. Mary'S UniversitySan Antonio, Tx1usaa.com
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