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Cloud Wang Email & Phone Number

SiP Process Engineering at Apple at 苹果
Location: Suzhou, Jiangsu, China 3 work roles 1 school
1 work email found @apple.com LinkedIn matched
✓ Verified May 2026 4 data sources Profile completeness 86%

Contact Signals · 1 work email

Work email c****@apple.com
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Current company
Role
SiP Process Engineering at Apple
Location
Suzhou, Jiangsu, China
Company size

Who is Cloud Wang? Overview

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Quick answer

Cloud Wang is listed as SiP Process Engineering at Apple at 苹果, a company with 218112 employees, based in Suzhou, Jiangsu, China. AeroLeads shows a work email signal at apple.com and a matched LinkedIn profile for Cloud Wang.

Cloud Wang previously worked as SiP Process Engineering at 苹果 and R&D Business Unit General Manger at China Wafer Level Csp Co.,Ltd.. Cloud Wang holds 学士, Environmental/Environmental Health Engineering from 上海交通大学.

Company email context

Email format at 苹果

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{first}.{last}@apple.com
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AeroLeads found 1 current-domain work email signal for Cloud Wang. Compare company email patterns before reaching out.

Profile bio

About Cloud Wang

Extensive experience in advanced sensor package technology development.

Current workplace

Cloud Wang's current company

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苹果
苹果
SiP Process Engineering at Apple
cupertino, california, united states
Website
Employees
218112
AeroLeads page
3 roles

Cloud Wang work experience

A career timeline built from the work history available for this profile.

Sip Process Engineering

Current

上海

Jun 2019 - Present

R&D Business Unit General Manger

China Wafer Level Csp Co.,Ltd.

中国 江苏 苏州

- Lead cross functional team to closely work with worldwide Tier 1 company. Developed Automotive 12” CIS TSV package, Fan-out CIS package, Under-Display optical finger print sensor package, Ultra thin TSV package, SiP solution for CIS and 3D sensing.- 40+ granted Chinese invention patents and 20+ granted international patents as 1st inventor.

Jul 2014 - May 2019

R&D Director

China Wafer Level Csp Co., Ltd.

中国 江苏 苏州

- Developed and qualified 12” CIS wafer level package technology, integrated supply chain to build up world 1st 12”CIS TSV CSP assembly line.- Developed 1st Gen finger print sensor wafer level package technology for iPhone 5s.

Mar 2013 - Jun 2014
Team & coworkers

Colleagues at 苹果

Other employees you can reach at apple.com. View company contacts for 218112 employees →

1 education record

Cloud Wang education

FAQ

Frequently asked questions about Cloud Wang

Quick answers generated from the profile data available on this page.

What company does Cloud Wang work for?

Cloud Wang works for 苹果.

What is Cloud Wang's role at 苹果?

Cloud Wang is listed as SiP Process Engineering at Apple at 苹果.

What is Cloud Wang's email address?

AeroLeads has found 1 work email signal at @apple.com for Cloud Wang at 苹果.

Where is Cloud Wang based?

Cloud Wang is based in Suzhou, Jiangsu, China while working with 苹果.

What companies has Cloud Wang worked for?

Cloud Wang has worked for 苹果, China Wafer Level Csp Co.,Ltd., and China Wafer Level Csp Co., Ltd..

Who are Cloud Wang's colleagues at 苹果?

Cloud Wang's colleagues at 苹果 include Cameron Williamson, Venkata Lahari Julakanti, Ben (Byoung Woon) Kim, Nargol Payman, and Ivan Filinskyy.

How can I contact Cloud Wang?

You can use AeroLeads to view verified contact signals for Cloud Wang at 苹果, including work email, phone, and LinkedIn data when available.

What schools did Cloud Wang attend?

Cloud Wang holds 学士, Environmental/Environmental Health Engineering from 上海交通大学.

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