I spent a little over 7.5 years of experience at Entegris (formerly CMC Materials) in Hillsboro, OR, where I contributed to the production of plastic polishing pads for the Chemical Mechanical Polishing (CMP) process used by the semiconductor industry. I bring a strong background in manufacturing process development and hands-on problem-solving. Before that, I spent more than 5 years as a CMP Manufacturing Technician at Intel’s D1D/D1X fab in Oregon.At Entegris, I evolved from an Engineering Technician supporting the production engineering team to a Process Development Engineer. My role was interdisciplinary and I was involved in process development, lab testing, material QC, purchasing, investigating product failure at the customer, and reporting and presenting to different business units.My greatest achievement there was completing a $1.7M project to implement a new powder handling system for the factory. I lead the planning, design, procurement, installation, and qualification of the system. Safety was the number one priority as the material handled was a combustible dust requiring attention to safety and cleanliness at every step of the process.At Intel, I was a manufacturing technician in the front end CMP area, where my regular tasks included consumable changes, daily equipment inspections, wafer processing, and performing engineering tests. I spent six months as the on-shift safety coordinator during a factory upgrade where I coordinated tool downtime and ensured adherence to Intel safety requirements for both our employees and contractors.Having recently taken a sabbatical, I'm now excited to pursue new career opportunities in Pennsylvania or other locations in the eastern USA. I’m eager to bring my technical expertise and project leadership experience to a new role in a dynamic industry.