Daewon Lee Email & Phone Number
@intel.com
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Who is Daewon Lee? Overview
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Daewon Lee is listed as Principal Engineer at InterDigital, Inc., a company with 10 employees, based in Portland, Oregon, United States. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Daewon Lee.
Daewon Lee previously worked as Principal Engineer at Intel Corporation and Systems Engineer at Intel Corporation. Daewon Lee holds Doctor Of Philosophy (Ph.D.), Electrical Engineering from Georgia Institute Of Technology.
Email format at InterDigital, Inc.
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AeroLeads found 1 current-domain work email signal for Daewon Lee. Compare company email patterns before reaching out.
About Daewon Lee
- Experience in wireless systems design and performance verification- Extensive background in R&D of (LTE/NR) cellular and 802.11 Wi-Fi systems and it’s standardization- Knowledgeable in 5G NR, 4G LTE physical layer specifications- Knowledgeable in IEEE 802.11 specifications - Experience in development of link and system level simulators for wireless systems- Inventor (co-inventor) of 600+ US patents- Editor of 3GPP TS38.215- Rapporteur of 3GPP TR38.807 and TR38.808Area of Expertise:- Communication System Simulation, Communication System Design- Signal Processing, MIMO Algorithms, Scheduling Algorithms, Sequence Design- Standards Development, NR and LTE Physical Layer Specification, 802.11 Specification- Simulator development for wireless communication systemsList of citations available at: http://scholar.google.com/citations?user=ATQTFRAAAAAJ&hl
Listed skills include Mimo, Lte, 3Gpp, Wireless, and 20 others.
Daewon Lee's current company
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Daewon Lee work experience
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Principal Engineer
Current3GPP (NR) RAN PHY Layer Standard Representative Delegate (Head of RAN1 Team)Research and Development of 5G NR Radio Access Layer 1 (Physical) specificationResearch and Development of Cellular Wireless Communication SystemsResearch and Development of open RAN architecture and algorithmsResearch and Development of 6G wireless systems
Systems Engineer
3GPP (NR) RAN PHY Layer Standard Representative DelegateResearch and Development of 5G NR Radio Access Layer 1 (Physical) specification
Principal Architect
IEEE 802.11 Standard Representative DelegateResearch and Development of IEEE 802.11ax (WiFi 6) specificationSoftware architect of simulators for 802.11 systems
Sr. Staff - System Engineer
3GPP (LTE) RAN PHY Layer Standard Representative DelegateResearch and development of LTE Radio Access Layer 1 (Physical) specification (MU-MIMO algorithms, device to device communications, small cell enhancements)Research and development of MIMO technology
Sr. Research Engineer
IEEE 802.11 and 3GPP (LTE) RAN1 standard representative delegateResearch and development of LTE Radio Access Network Layer 1 (Physical) specificationResearch and development of IEEE 802.11ac (WiFi 5) specification Developed system-level and link-level simulators for LTE and 802.11 systems
Research Engineer
3GPP (LTE) RAN1 standard representative delegateResearch and Development of LTE Radio Access Network Layer 1 (Physical) specification (sequence design, channel estimation, and control/data channel design)Designed optimized linear algebra & mathematics software library based on C/C++ for MIMO simulationsDeveloped system-level and link-level simulators for LTE
Colleagues at InterDigital, Inc.
Other employees you can reach at intel.com. View company contacts for 10 employees →
Thao Pham
Colleague at Interdigital, Inc.
Folsom, California, United States, United States
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FE
Flemming Erikstrup
Colleague at Interdigital, Inc.
Chandler, Arizona, United States, United States
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AK
Ajeesh K Shanmughan
Colleague at Interdigital, Inc.
Thrissur, Kerala, India, India
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AK
Amol Karnik
Colleague at Interdigital, Inc.
Singapore, Singapore
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JB
Justin Bjoin
Colleague at Interdigital, Inc.
Queen Creek, Arizona, United States, United States
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孙
孙玉莹
Colleague at Interdigital, Inc.
Minhang District, Shanghai, China, China
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ML
Ming Lin
Colleague at Interdigital, Inc.
Santa Clara, California, United States, United States
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EB
Eddie Bates
Colleague at Interdigital, Inc.
Austin, Texas, United States, United States
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TD
Thu Dang
Colleague at Interdigital, Inc.
Ho Chi Minh City, Vietnam, Viet Nam
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VS
Vaishali Shakya
Colleague at Interdigital, Inc.
Bengaluru, Karnataka, India, India
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Daewon Lee education
Doctor Of Philosophy (Ph.D.), Electrical Engineering
Master’S Degree, Electrical Engineering
Bachelor’S Degree, Electrical Engineering
Frequently asked questions about Daewon Lee
Quick answers generated from the profile data available on this page.
What company does Daewon Lee work for?
Daewon Lee works for InterDigital, Inc..
What is Daewon Lee's role at InterDigital, Inc.?
Daewon Lee is listed as Principal Engineer at InterDigital, Inc..
What is Daewon Lee's email address?
AeroLeads has found 1 work email signal at @intel.com for Daewon Lee at InterDigital, Inc..
Where is Daewon Lee based?
Daewon Lee is based in Portland, Oregon, United States while working with InterDigital, Inc..
What companies has Daewon Lee worked for?
Daewon Lee has worked for Interdigital, Inc., Intel Corporation, Newracom, Broadcom, and Lg Electronics.
Who are Daewon Lee's colleagues at InterDigital, Inc.?
Daewon Lee's colleagues at InterDigital, Inc. include Thao Pham, Flemming Erikstrup, Ajeesh K Shanmughan, Amol Karnik, and Justin Bjoin.
How can I contact Daewon Lee?
You can use AeroLeads to view verified contact signals for Daewon Lee at InterDigital, Inc., including work email, phone, and LinkedIn data when available.
What schools did Daewon Lee attend?
Daewon Lee holds Doctor Of Philosophy (Ph.D.), Electrical Engineering from Georgia Institute Of Technology.
What skills is Daewon Lee known for?
Daewon Lee is listed with skills including Mimo, Lte, 3Gpp, Wireless, Simulations, Signal Processing, Ieee 802.11, and Cellular Communications.
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