Daewon Lee
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Daewon Lee Email & Phone Number

Principal Engineer at InterDigital, Inc.
Location: Portland, Oregon, United States 7 work roles 3 schools
1 work email found @intel.com LinkedIn matched
✓ Verified May 2026 4 data sources Profile completeness 100%

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Work email d****@intel.com
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Current company
Role
Principal Engineer
Location
Portland, Oregon, United States
Company size

Who is Daewon Lee? Overview

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Quick answer

Daewon Lee is listed as Principal Engineer at InterDigital, Inc., a company with 10 employees, based in Portland, Oregon, United States. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Daewon Lee.

Daewon Lee previously worked as Principal Engineer at Intel Corporation and Systems Engineer at Intel Corporation. Daewon Lee holds Doctor Of Philosophy (Ph.D.), Electrical Engineering from Georgia Institute Of Technology.

Company email context

Email format at InterDigital, Inc.

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{first}.{last}@intel.com
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Profile bio

About Daewon Lee

- Experience in wireless systems design and performance verification- Extensive background in R&D of (LTE/NR) cellular and 802.11 Wi-Fi systems and it’s standardization- Knowledgeable in 5G NR, 4G LTE physical layer specifications- Knowledgeable in IEEE 802.11 specifications - Experience in development of link and system level simulators for wireless systems- Inventor (co-inventor) of 600+ US patents- Editor of 3GPP TS38.215- Rapporteur of 3GPP TR38.807 and TR38.808Area of Expertise:- Communication System Simulation, Communication System Design- Signal Processing, MIMO Algorithms, Scheduling Algorithms, Sequence Design- Standards Development, NR and LTE Physical Layer Specification, 802.11 Specification- Simulator development for wireless communication systemsList of citations available at: http://scholar.google.com/citations?user=ATQTFRAAAAAJ&hl

Listed skills include Mimo, Lte, 3Gpp, Wireless, and 20 others.

Current workplace

Daewon Lee's current company

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InterDigital, Inc.
Interdigital, Inc.
Principal Engineer
Portland, OR, US
Website
Employees
10
AeroLeads page
7 roles

Daewon Lee work experience

A career timeline built from the work history available for this profile.

Principal Engineer

Current

Santa Clara, California, US

3GPP (NR) RAN PHY Layer Standard Representative Delegate (Head of RAN1 Team)Research and Development of 5G NR Radio Access Layer 1 (Physical) specificationResearch and Development of Cellular Wireless Communication SystemsResearch and Development of open RAN architecture and algorithmsResearch and Development of 6G wireless systems

Apr 2020 - Present

Systems Engineer

Santa Clara, California, US

3GPP (NR) RAN PHY Layer Standard Representative DelegateResearch and Development of 5G NR Radio Access Layer 1 (Physical) specification

Oct 2016 - Mar 2020

Principal Architect

Irvine, California, US

IEEE 802.11 Standard Representative DelegateResearch and Development of IEEE 802.11ax (WiFi 6) specificationSoftware architect of simulators for 802.11 systems

Oct 2014 - Sep 2016

Sr. Staff - System Engineer

Palo Alto, California, US

3GPP (LTE) RAN PHY Layer Standard Representative DelegateResearch and development of LTE Radio Access Layer 1 (Physical) specification (MU-MIMO algorithms, device to device communications, small cell enhancements)Research and development of MIMO technology

May 2013 - Sep 2014

Sr. Research Engineer

Seoul, KR

IEEE 802.11 and 3GPP (LTE) RAN1 standard representative delegateResearch and development of LTE Radio Access Network Layer 1 (Physical) specificationResearch and development of IEEE 802.11ac (WiFi 5) specification Developed system-level and link-level simulators for LTE and 802.11 systems

Jan 2010 - Jul 2011

Research Engineer

Seoul, KR

3GPP (LTE) RAN1 standard representative delegateResearch and Development of LTE Radio Access Network Layer 1 (Physical) specification (sequence design, channel estimation, and control/data channel design)Designed optimized linear algebra & mathematics software library based on C/C++ for MIMO simulationsDeveloped system-level and link-level simulators for LTE

Mar 2006 - Dec 2009
Team & coworkers

Colleagues at InterDigital, Inc.

Other employees you can reach at intel.com. View company contacts for 10 employees →

3 education records

Daewon Lee education

Doctor Of Philosophy (Ph.D.), Electrical Engineering

Georgia Institute Of Technology

Master’S Degree, Electrical Engineering

Korea Advanced Institute Of Science And Technology

Bachelor’S Degree, Electrical Engineering

Korea Advanced Institute Of Science And Technology
FAQ

Frequently asked questions about Daewon Lee

Quick answers generated from the profile data available on this page.

What company does Daewon Lee work for?

Daewon Lee works for InterDigital, Inc..

What is Daewon Lee's role at InterDigital, Inc.?

Daewon Lee is listed as Principal Engineer at InterDigital, Inc..

What is Daewon Lee's email address?

AeroLeads has found 1 work email signal at @intel.com for Daewon Lee at InterDigital, Inc..

Where is Daewon Lee based?

Daewon Lee is based in Portland, Oregon, United States while working with InterDigital, Inc..

What companies has Daewon Lee worked for?

Daewon Lee has worked for Interdigital, Inc., Intel Corporation, Newracom, Broadcom, and Lg Electronics.

Who are Daewon Lee's colleagues at InterDigital, Inc.?

Daewon Lee's colleagues at InterDigital, Inc. include Thao Pham, Flemming Erikstrup, Ajeesh K Shanmughan, Amol Karnik, and Justin Bjoin.

How can I contact Daewon Lee?

You can use AeroLeads to view verified contact signals for Daewon Lee at InterDigital, Inc., including work email, phone, and LinkedIn data when available.

What schools did Daewon Lee attend?

Daewon Lee holds Doctor Of Philosophy (Ph.D.), Electrical Engineering from Georgia Institute Of Technology.

What skills is Daewon Lee known for?

Daewon Lee is listed with skills including Mimo, Lte, 3Gpp, Wireless, Simulations, Signal Processing, Ieee 802.11, and Cellular Communications.

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