Lead worldwide marketing activity on electrical and optical metrology products.

Responsible for electrical and optical metrology product marketing worldwide customer support.

o Responsible for supporting KLA-Tencor's EBEAM inspection and review products includes product penetration/adoption at customer facilities. This includes training customers and other apps engineers, head-head (H2H) activities, investigating customer technical needs/problems and providing solutions, conducting final acceptance, demonstrating products, and understanding competitive situations, methodology. o Characterization of new systems and features. This includes designing and conducting experiments, collecting data, publishing results and recommendations in the form of applications notes, best known methods or characterization studies and transferring product knowledge to K-T’s worldwide Field Applications team.o Work closely with many organizations including engineering, sales and marketing within K-T and with customer engineers outside KLA-Tencor.

- Develop advanced low-k dielectric precursors for back-end-of-line IC application and collaborate with customers from semiconductor industry.-Work directly on industry-scale PECVD, involved in processing recipe optimization, tool trouble-shooting and maintenance.-Work in cross-functional team setting including chemists, process engineers, other interns, and facility maintenance technicians.-Present work to management team, contributed data for IP application, sales/marketing team and conference presentations.

1. Member of Electronics group, developing advanced low-k precursors for semiconductor industry customers;2. Led development of ellipsometric porosimetry (EP) for porosity characterization;-Researched, designed, and coordinated manufacturing of testing vacuum chamber.-Developed SOP and data analysis program, enhanced test accuracy and efficiency.3. Coordinated collaboration between UD and Air Liquide to ensure quality and timely results;- Explored XRR as a new material density characterization technique, proposed and presented the feasibility to management and proved for long-term implement.

1. Metrology understanding and development for porous low-k dielectrics characterization.-Optimized Nanoindentation procedure for mechanical characterization, significantly reduced substrate interference.-Studied the complementarity of three porosimetry techniques, PALS, EP and XRR, understood their advantages and limitations in characterizing porous dielectrics of different connectivity.-Mechanical reinforcement of low-k dielectrics via modification of precursor chemistry-Superior mechanical properties had been realized through introducing alkane bridge into precursor.2. Silicon surface modification;-Substantially enhanced silicon wafer lifetime by wet-organic surface passivation; studied interface electron retarding phenomenon due to surface charging;-Comprehensively characterized laser-pulsed silicon (“black silicon”) from morphology, crystallinity, phase and compositional distribution using SEM/EDEX, XRD, UV-Vis and XPS to understand the optical properties dependence on processing conditions.-Maintained and coordinated XPS in surface science lab; consulted on test specifications based on project requirements, responsible for daily maintenance, schedule coordination and operation training