Daniel Cowperthwait Email & Phone Number

United States

3028 E Cornwallis Rd, Durham NC 27709

Qualification and characterization of industrial and automotive discrete NPI (new product introduction) products (MOSFETs & diodes) on the Wolfspeed SiC substrate platform. This role involves development from material/epitaxy through packaging including fab, TDI (test/probe, dice & inspect) for multiple manufacturing sites. Specific characterization.

Research Triangle Park, NC

SiC Power Product Engineering- Manager of the technical support team for SiC power (MOSFET & Schottky diode) product engineering- Qualified a duplicate 150mm Schottky diode production line at the main Durham factory- Qualified 150mm Schottky diode production flow- Revamped process change structure for Wolfspeed- Performance monitoring of 100mm and 150mm.

Hillsboro, Oregon

Lithography module engineer for a power semiconductor device manufacturer.

Albuquerque, New Mexico Area

Group Lead for C4 module of Fab 11X in Rio Rancho, NM-Manage litho, etch, DHV & plate modules in C4-Manage >20 individual contributors-Member of the C4 quality forum-C4 Safety Pillar owner-Application of Lean Manufacturing principles-Member of the C4 plating high precision maintenance team-C4 liason to factory ops

• Project manager for industrial laboratory including assembly, infrastructure, personnel management, purchasing, documentation, safety and training
• Metrology ownership, characterization and calibration to ISO 9001:2008 standards
• Developed quality management system
• Project manager over SPC deployment
• Key customer-oriented quality assurance tracking, improvement and reporting
• Developed and maintained the document control system

• Managed startup activities, oversaw equipment installations/modifications, installed/qualified lab equipment, and coordinated spare parts purchases
• Managed mix station supervisor and operators
• Documented work instructions
• Critical daily customer technical and quality support and reporting of key metrics
• Reviewed P&IDs with German engineers during startup to assess compliance to design and assist in adjustment to optimize slurry and component conveyance

• Layer, process, and tool ownership in semiconductor lithography area
• Extensive work with product integration engineers on new product development
• Creation and updating of process and equipment specifications
• Metrology ownership for SEM tools and thin film thickness tools and proficient on overlay and advanced SEM tools as well

• Owned innerlayer PCB core and artwork inspection
• Brought in and trained operators on PCB CAD Reference station
• Primary liaison between Orbotech Inc. and Praegitzer in Huntsville
• Responsible for the 20% reduction in final PCB scrap due to innerlayer defect escapes
• Responsible for updating documentation to ISO standards

• Process owner of wet etches, wet cleans, metrology, and inspection
• Process development with plasma etch process owner to achieve oxide and polysilicon etch profiles using Tegal and Applied Materials tools
• Sustained photolithography and etch processes on the off shift
• Responsible for updating documentation to ISO/QS standards
• Use of SPCs, FMEAs, and DOEs for process tracking, containment, and enhancement
• Films metrology gage capability analysis

Bs, Electrical Engineering

Activities and Societies: IEEE Student Branch President - 1993 IEEE Student Branch Secretary - 1992-1993Helped restart the electric car.

Mechanical Engineering

Activities and Societies: Naval ROTC