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Daniel Piper Email & Phone Number
Senior Product Engineer
at
IBM
2 work emails found
@ibm.com
1 phone found area 360
LinkedIn matched
✓ Verified July 2026
4 data sources
Profile completeness 100%
Current company
Role
Senior Product Engineer
Location
Vancouver, Washington, United States
Company size
Who is Daniel Piper? Overview
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Quick answer
Daniel Piper is listed as Senior Product Engineer at IBM, a with 512090 employees, based in Vancouver, Washington, United States. AeroLeads shows a work email signal at ibm.com, phone signal with area code 360, and a matched LinkedIn profile for Daniel Piper.
Daniel Piper previously worked as Senior Functional Characterization Engineer at Ibm and Device Integration Engineer at Ibm. Daniel Piper holds Master Of Science (Msc), Electrical Engineering from Oregon Health And Science University.
Company email context
Email format at IBM
This section adds company-level context without repeating Daniel Piper's masked contact details.
{first_initial}{last}@ibm.com
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AeroLeads found 2 current-domain work email signals for Daniel Piper. Compare company email patterns before reaching out.
Profile bio
About Daniel Piper
Daniel Piper is a Senior Product Engineer at IBM. He possess expertise in lithography, wafer e test characterization, 8" fab and 12" fab process integration, military leadership. He is proficient in French.
Listed skills include Lithography, Wafer E Test Characterization, 8" Fab And 12" Fab Process Integration, and Military Leadership.
Current workplace
Daniel Piper's current company
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Ibm
5 roles
Daniel Piper work experience
A career timeline built from the work history available for this profile.
Senior Functional Characterization Engineer
Within IBM's fabless business model since 2015 my role is to provide kerf characterization and wafer functional characterization for all of IBM Systems ASIC & RF products that are used in the P,Z & storage branded products. I have supported the Global Foundries teams at East Fishkill NY and Burlington Vt on many technologies (22nm, 32nm, 45nm, 65nm, 90nm, 130nm & 180nm). Previously I was responsible for characterization of IBM games process for Nintendo & Sony on the 45nm nodeNew opportunities beginning in 2021 in yield modeling are now on my plate as well as functional characterization for IBM Z in the near future too
Device Integration Engineer
I tackle the challenges associated with sources of variability associated with CMOS device power performance, in order to optimize circuit limited yield within a leading edge semiconductor manufacturing fab.
Nov 2011 - Dec 2013
Staff Process Integration Engineer
I was responsible for the introduction of new technology qualification, and new customer design introduction. The handling of volume production for inline and E-test data analysis. Optimization of device process window to reduce defectivity & cycle time, and improve yield
Oct 2000 - Nov 2011
Infantry Officer
Finished ranked as an Army Reserve Captain tasked as an infantry company 2IC. Prior to that was tasked as a infantry platoon commander responsible for all aspects of leading, training and planning in garrison and field exercises
Jun 1994 - Oct 2000
Team & coworkers
Colleagues at IBM
Other employees you can reach at ibm.com. View company contacts for 512090 employees →
贾
贾振一
Colleague at IbmDaxing District, Beijing, China
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TM
Thomas Mellios
Colleague at IbmAthens, Attiki, Greece
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RB
Rolf Beyer
Colleague at IbmGreater Munich Metropolitan Area, Germany
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IS
Ian Sherwood
Colleague at IbmFarnborough, England, United Kingdom
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AB
Adarsh Basireddy
Colleague at IbmCreston, Ohio, United States
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KC
Kerrie Collins
Colleague at IbmRaleigh-Durham-Chapel Hill Area, United States
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袁
袁映卓
Colleague at IbmHong Kong Sar, Hong Kong
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RF
Rick Fan
Colleague at IbmDalian, Liaoning, China
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TS
Thummapudi Sai Kumar
Colleague at IbmNellore, Andhra Pradesh, India
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AR
Aravind Reddy Beeda
Colleague at IbmBangalore Urban District, India
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贾振一
Colleague at IbmDaxing District, Beijing, China
View →
TM
Thomas Mellios
Colleague at IbmAthens, Attiki, Greece
View →
RB
Rolf Beyer
Colleague at IbmGreater Munich Metropolitan Area, Germany
View →
IS
Ian Sherwood
Colleague at IbmFarnborough, England, United Kingdom
View →
AB
Adarsh Basireddy
Colleague at IbmCreston, Ohio, United States
View →
KC
Kerrie Collins
Colleague at IbmRaleigh-Durham-Chapel Hill Area, United States
View →
袁
袁映卓
Colleague at IbmHong Kong Sar, Hong Kong
View →
RF
Rick Fan
Colleague at IbmDalian, Liaoning, China
View →
TS
Thummapudi Sai Kumar
Colleague at IbmNellore, Andhra Pradesh, India
View →
AR
Aravind Reddy Beeda
Colleague at IbmBangalore Urban District, India
View →
2 education records
Daniel Piper education
Master Of Science (Msc), Electrical Engineering
Bachelor Of Science (Bsc), Physics
University College Of The Cariboo
FAQ
Frequently asked questions about Daniel Piper
Quick answers generated from the profile data available on this page.
What company does Daniel Piper work for?
Daniel Piper works for IBM.
What is Daniel Piper's role at IBM?
Daniel Piper is listed as Senior Product Engineer at IBM.
What is Daniel Piper's email address?
AeroLeads has found 2 work email signals at @ibm.com for Daniel Piper at IBM.
What is Daniel Piper's phone number?
AeroLeads has found 1 phone signal(s) with area code 360 for Daniel Piper at IBM.
Where is Daniel Piper based?
Daniel Piper is based in Vancouver, Washington, United States while working with IBM.
What companies has Daniel Piper worked for?
Daniel Piper has worked for Ibm, Wafertech, and Canadian Armed Forces.
Who are Daniel Piper's colleagues at IBM?
Daniel Piper's colleagues at IBM include 贾振一, Thomas Mellios, Rolf Beyer, Ian Sherwood, and Adarsh Basireddy.
How can I contact Daniel Piper?
You can use AeroLeads to view verified contact signals for Daniel Piper at IBM, including work email, phone, and LinkedIn data when available.
What schools did Daniel Piper attend?
Daniel Piper holds Master Of Science (Msc), Electrical Engineering from Oregon Health And Science University.
What skills is Daniel Piper known for?
Daniel Piper is listed with skills including Lithography, Wafer E Test Characterization, 8" Fab And 12" Fab Process Integration, and Military Leadership.
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