Dan Sides
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Dan Sides Email & Phone Number

RTL Design Engineer at Intel Corporation at Intel Corporation
Location: Beaverton, Oregon, United States 8 work roles 2 schools
2 work emails found @intel.com 1 phone found area 408 LinkedIn matched
✓ Verified May 2026 4 data sources Profile completeness 100%

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Work email d****@intel.com
Direct phone (408) ***-****
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Current company
Role
RTL Design Engineer at Intel Corporation
Location
Beaverton, Oregon, United States
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Who is Dan Sides? Overview

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Quick answer

Dan Sides is listed as RTL Design Engineer at Intel Corporation at Intel Corporation, a company with 133841 employees, based in Beaverton, Oregon, United States. AeroLeads shows a work email signal at intel.com, phone signal with area code 408, and a matched LinkedIn profile for Dan Sides.

Dan Sides previously worked as IP Design Engineer at Intel Corporation and FPGA Design Contractor at Intel Corporation. Dan Sides holds Ms, Electrical Engineering from University Of North Carolina At Charlotte.

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{first}.{last}@intel.com
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Profile bio

About Dan Sides

Electronics Engineering Highlights • Verilog & VHDL RTL design. • FPGA & ASIC design. • Simulation, synthesis, map, place and route, implementation and debug. • Lead and management experience. • Verification and test plan development. • Subsystem architecture, planning & design documentation. • Gate level simulation, netlist debug, scripting, silicon debug.Leadership/Management Highlights:* Over 7 years experience in team leadership.* Managed a 14 person, cross-global applications engineering team.* Project scheduling, goal setting, budget management, and cross-functional communications, and performance reviews.

Listed skills include Fpga, Asic, Verilog, Timing Closure, and 19 others.

Current workplace

Dan Sides's current company

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Intel Corporation
Intel Corporation
RTL Design Engineer at Intel Corporation
santa clara, california, united states
Website
Employees
133841
AeroLeads page
8 roles · 30 years

Dan Sides work experience

A career timeline built from the work history available for this profile.

Ip Design Engineer

Current

Hillsboro, OR

-QuickPath Interconnect (QPI) Link Layer Design -Verilog design, synthesis and simulation.

Jan 2015 - Present

Fpga Design Contractor

Current
  • Designed link layer for next generation, QuickPath Interconnect (QPI) in Verilog. QPI link layer provides reliable, point-to-point cache coherent transfer of data between processors.
  • Design included full-duplex, high speed header & data processing, retry control, generation &servicing, control packet parsing & generation, credit usage & tracking, header & data pipelining, & CRC checking & generation.
  • Developed link layer architecture, implemented Verilog RTL design, & performed unit level simulation.
  • Ran system level simulation/verification & debug.
  • Revised an existing LRU design for improved system performance. Wrote Verilog RTL. Performed high speed synthesis, place & route, & static timing targeting Altera & Xilinx FPGAs.
  • Also implemented Signaltap embedded logic analyzer for existing FPGA design.
2013 - Present ~13 yrs 4 mos

Lead Fpga Ip Design Engineer

Hillsboro, OR

  • Design & Verification of Platform Management Control Chipsets
  • Designed & verified fault logging buffer intellectual property (IP). Design buffered ingress data frames for storage to non-volatile memory when board fault is detected. Featured pre-emptive storage architecture.
  • Designed & verified full-duplex, self-synchronous, chip-to-chip serial interface. IP was configurable per frame size, memory size & type & data length widths. Featured CRC & ACK checking & error counting. Designed.
  • Both IPs were delivered ahead of schedule with no bugs found during system level verification.
  • Intellectual property lead engineer. Responsibilities included approving technical specifications, usage models & software GUIs. Provided project reports, attended project summits & status meetings.
2010 - 2012 ~2 yrs

Fpga Engineering Manager

Lattice Semiconductor
  • Managed low density & mixed signal applications group, with locations in Hillsboro, Bangalore, & Shanghai, reporting to Corporate Vice President.
  • Set annual goals & gave reviews for 14 employees (13 engineers & one manager).
  • Directed the delivery of marketing collateral for three new Lattice products. This includes scheduling & approving reference designs, tech notes, usage models, evaluation boards, & eval board demos.
  • Increased number of reference designs from 8 to over 50 within two years.
  • Directed customer evaluation board design, debug & production for 10 new evaluation boards.
  • Started Bangalore low density applications team.
2008 - 2010 ~2 yrs

Fpga Applications Engineer

  • Supported Tier 1 customer FPGA projects: Verilog & VHDL RTL design work, simulation support,reference designs, & lab debug.
  • Wrote usage models, tech notes, blogs & magazine articles.
  • Worked tech support & ran tech support metrics.
  • Created reference designs & FAQs.
  • Wrote & presented customer & FAE training material & webcasts.
  • Visited customer sites & attended trade conferences.
2006 - 2008 ~2 yrs

Asic Design Engineer

Hillsboro, OR

  • Front end validation for enterprise chipsets:
  • Performed post layout gate level simulation (GLS) effort for a dual core, Xeon north bridge chip with PCI-Express & FBD support.
  • Built GLS environments, regressed test suites, wrote Perl automation scripts & debugged tests.
  • Performed first silicon functional testing on an Agilent tester.Front end ASIC design/verification for telecom edge termination equipment:
  • Designed & documented an HDLC framer & generator for an OC3 stream from a SONET Framer/Mapper.
  • Led the verification environment effort for an HDLC/ATM datalink controller. Wrote test plan, built Specman environment & wrote tests.
2001 - 2006 ~5 yrs

Asic Designer

Raleigh, NC

  • Front end design and product definition for network processors and metro area network devices.
  • Led a 4 person team in a feasibility assessment of producing a 10 Gbps WAN mode Ethernet to OC192 SONET bridge ASIC.
  • Designed a high performance, pipelined policer and statistics manager for a 40 Gbps IP network processor.
  • Designed a frame buffer pointer queueing system for a 10 Gbps IP network processor.
  • Team was acquired by Intel.
2000 - 2001 ~1 yr

Asic Design Consultant

Raleigh, NC

  • Provided on-site design, test and implementation consulting for tier 1 customer engagements.
  • Assisted with sales calls, statements of work, & consulting estimates.
  • Designed (Verilog) the receive side of an ATM based set-top-box ASIC, connected to a fiber-to-the-curb broadband network. Also wrote test plan.
  • Implemented a cable modem board verification environment, resulting in full customer adoption.
  • Performed static timing for customers.
  • Converted LSSD PowerPC microprocessor VHDL design to a rising edge, flip flop implementation with gated clocks & muxed feedback.
1996 - 2000 ~4 yrs
Team & coworkers

Colleagues at Intel Corporation

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2 education records

Dan Sides education

FAQ

Frequently asked questions about Dan Sides

Quick answers generated from the profile data available on this page.

What company does Dan Sides work for?

Dan Sides works for Intel Corporation.

What is Dan Sides's role at Intel Corporation?

Dan Sides is listed as RTL Design Engineer at Intel Corporation at Intel Corporation.

What is Dan Sides's email address?

AeroLeads has found 2 work email signals at @intel.com for Dan Sides at Intel Corporation.

What is Dan Sides's phone number?

AeroLeads has found 1 phone signal(s) with area code 408 for Dan Sides at Intel Corporation.

Where is Dan Sides based?

Dan Sides is based in Beaverton, Oregon, United States while working with Intel Corporation.

What companies has Dan Sides worked for?

Dan Sides has worked for Intel Corporation, Lattice Semiconductor, Intel, Nortel Networks, and Mentor Graphics.

Who are Dan Sides's colleagues at Intel Corporation?

Dan Sides's colleagues at Intel Corporation include Daniel Axel, Arunraj Mohan (Arun), Colleen Martinez, Carmelita Dunican, and Laura Devany Grow.

How can I contact Dan Sides?

You can use AeroLeads to view verified contact signals for Dan Sides at Intel Corporation, including work email, phone, and LinkedIn data when available.

What schools did Dan Sides attend?

Dan Sides holds Ms, Electrical Engineering from University Of North Carolina At Charlotte.

What skills is Dan Sides known for?

Dan Sides is listed with skills including Fpga, Asic, Verilog, Timing Closure, Semiconductors, Logic Design, Embedded Systems, and Simulations.

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