Spearhead installation, buyoff, and servicing of SolderBall Mount machines, specializing in Flip Chip and Substrate BGA package technologies.Provides expert process tooling setup support to customers, ensuring optimal machine performance.Conducts comprehensive training sessions for new customers on machine operation and preventive maintenance protocols.Delivers prompt and effective ad-hoc issue resolution through telephonic and on-site support.Manages and maintains key regional customer account across Japan, China, Malaysia, Taiwan, fostering strong business relationship. Customer base including TSMC, Micron, ASEK, SPIL & etc.