Co-Packaged Optics Product Engineering

Electro-optical and mechanical architecture of next Lidar products, strong interaction with System-architecture, Board, Algo, and Manufacturing.

- Stereo Depth and Color camera development for consumer products.- Cameras for SLAM/Tracking, Face-authentication, Security, using various sensors, optics and ISP's. Image quality ISP tuning.- Coded light depth camera development and transition to HVM.- CMOS image sensor design and tape-out, optical design for low-cost, laser projectors.

Development of 3D camera for gesture recognition

THz technology. Development of a laser-based THz spectrometer.

CMOS sensor low-cost uncooled thermal camera development.

• Project Manager: 10Gb/s Laser-Modulator- fiber coupled.• R&D focal-point for marketing & sales, New project and R&D programs with European/US partners.

• Managing E/O R&D group of 10 people. Building an innovative 40Gb/s high-speed lab.• 40G Laser (patent) and modulator - team and project management and Hands-on lab development.• Fiber coupling on silicon optical bench.

Semiconductor - fiber grating coupled laser for optical communication

2004-2007 (EE), 1994-1996 (Physics), Teaching excellence award (1995). Optics, EM waves & distributed systems, Photonics projects supervisor.