David Hays Email and Phone Number
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David Hays personal email
* Significant high-tech sales, sales management and business development experience with emphasis on the processing and advanced packaging of semiconductors* Also experienced in the sales of software (CAD/CAM/CAE, databases, document management), capital equipment (processing, testing, measuring, computing) and related services* Unique combination of capital equipment sales experience and advanced semconductor packaging expertise* Prior experience in the following roles: Region Sales Manager, Director of North American Sales, Director Business Development, VP Business Development and VP Sales & MarketingSpecialties: * Marketing and business development of new technologies* Hiring, coaching and developing sales and customer service teams as Director and/or VP Sales* Advanced packaging technologies including flip chip and wafer level packaging, copper pillar, embedded die packaging. * Semiconductor FEOL and BEOL capital equipment (new and used) * Experienced in using and educating others on the application of Miller Heiman's Conceptual Selling, Strategic Selling and Large Account Management Program* Semiconductor and related capital equipment experience includes: ALD, thermal (CVD/PVD/RTP/RTA) plasma, wet chemical, electroplating (Cu, PbSn, Au, Ni, AgSn, etc.), XRF/TXRF/VPD, lithography, gas abatement, wafer probe and package testing, metrology (particle counters, chemical composition/replenishment, profiling, CD, thickness, uniformity, 3D surface profiling (including aspherical and free-form optics), etc.) energy conservation (solid state lighting, chiller optimization), services (equipment and part repair/refurbishment, nano-molecular coatings for surface modification.
Ups Industrial Services, Llc.
View- Website:
- upsindustrial.com
- Employees:
- 332
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Senior Sales Executive - Semiconductor MarketUps Industrial Services, Llc.North Carolina, United States
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Business Development Manager, Global Account ManagerSchunk Xycarb Technology Oct 2016 - PresentHelmond, North Brabant, NlResponsibilities include management of existing customers, development of new customers and global key account management (largest foundry in U.S.). Focused on components utilized in EPI, MOCVD, etch, CVD, PVD, and related processes which utilize quartz, ceramic, graphite, CVD SiC graphite, silicon and other advanced materials. -
Director Business DevelopmentProcess Technology Jun 2015 - Oct 2016Willoughby, Ohio, UsDevelopment of new customers and markets for high purity fluid heating applications. Management of Asia-based distribution partners. -
Brand ManagerCarsem Jun 2014 - May 2015Ipoh, Perak, MyBrand management of Carsem's entire product portfolio of semiconductor packaging assembly and test services for selected existing key and new accounts within the Eastern half of the U.S. -
Director Sales, U.S. East & Chipsett Business DevelopmentFlipchip International Sep 2012 - Jun 2013Phoenix, Arizona, UsResponsible for management of existing customer base plus new business development in Eastern half of U.S. and selected key accounts across the U.S. Responsibilities also include driving new business development of FCI's ChipsetT, turnkey embedded die packaging solution. -
President And OwnerProgression Solutions Jan 2010 - Sep 2012Independent Manufacturer's Sales Representative focused on advanced packaging services and capital equipment for the semiconductor, MEMS, solar, LED, nanotechnology, optics, medical devices, biotech and pharma markets in the Eastern U.S. Providing solutions for:- Wet chemical processing systems (wet benches, electroplating/electropolishing, concentration monitoring, delivery/blending)- High purity fluid heating systems (immersion, inline, point of use, facility, etc.)- Thermal processing (ALD, LPCVD, PECVD, RTP, RTA, RTCVD, plasma, gas purifier, gas abatement, heating elements, hot plates)- Lithography (mask or maskless), Track systems, Spinners- Surface modification (nano-molecular coatings)- Packaging, Assembly & Test * Wafer Level Packaging Services (bumping, RDL, grind/dice/pick) * Test Sockets, Pogo Pins, Probe Cards & Coax Connectors * High speed, high precision die bonders, laminators and remounters (focused on RF and optical applications)- Metrology (3D surface analysis, film thickness, film quality, chem concentration monitoring, particle counting, aspheric and free-form optics, nano and micro analysis of materials (topography, composition, thermal and mechanical))- Cleanroom equipment and supplies- Services (equipment, process and test engineering)- Energy Reduction/Sustainability (solid state lighting, chiller optimization)Specialized Skills:- Leveraging 30+ years of experience to help high technology manufacturing companies maximize their revenues and profitability- Emphasis on high tech, cleanroom-based, manufacturing industries and research and development- Global network of contacts and resources
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Vp Wlp Business UnitAmkor Technology Jun 2003 - Jun 2009Tempe, Arizona, UsResponsible for business development of advanced packaging technology services including: wafer bumping, wafer level chip scale packaging (WLCSP), Cu pillar, integrated passives, redistribution layer (RDL) and die packaging (probe, thinning, singulation, pick to pocket tape, etc.) services. Also involved in capital equipment evaluation, CAPEX and capacity planning, demand forecasting, cost modeling, marketing, customer project management and competitive analysis. -
Independent Sales ConsultantMiller Heiman 2003 - 2003
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Director SalesSemitool 1995 - 2002Kalispell, Mt, Us -
SalesIntergraph 1989 - 1995
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Sales EngineerTeradyne 1979 - 1985
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Sales EngineerHewlett Packard (Now Agilent Technologies) 1977 - 1979
David Hays Skills
David Hays Education Details
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Purdue UniversityElectrical Engineering
Frequently Asked Questions about David Hays
What company does David Hays work for?
David Hays works for Ups Industrial Services, Llc.
What is David Hays's role at the current company?
David Hays's current role is Senior Sales Executive - Semiconductor Market.
What is David Hays's email address?
David Hays's email address is da****@****hip.com
What schools did David Hays attend?
David Hays attended Purdue University.
What skills is David Hays known for?
David Hays has skills like Semiconductors, Manufacturing, Electronics, Semiconductor Industry, Product Management, Ic, New Business Development, Strategy, Metrology, Leadership, Spc, Cross Functional Team Leadership.
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