David Hays Email & Phone Number

North Carolina, United States

Helmond, North Brabant, Nl

Responsibilities include management of existing customers, development of new customers and global key account management (largest foundry in U.S.). Focused on components utilized in EPI, MOCVD, etch, CVD, PVD, and related processes which utilize quartz, ceramic, graphite, CVD SiC graphite, silicon and other advanced materials.

Willoughby, Ohio, Us

Development of new customers and markets for high purity fluid heating applications. Management of Asia-based distribution partners.

Ipoh, Perak, My

Brand management of Carsem's entire product portfolio of semiconductor packaging assembly and test services for selected existing key and new accounts within the Eastern half of the U.S.

Phoenix, Arizona, Us

Responsible for management of existing customer base plus new business development in Eastern half of U.S. and selected key accounts across the U.S. Responsibilities also include driving new business development of FCI's ChipsetT, turnkey embedded die packaging solution.

Independent Manufacturer's Sales Representative focused on advanced packaging services and capital equipment for the semiconductor, MEMS, solar, LED, nanotechnology, optics, medical devices, biotech and pharma markets in the Eastern U.S. Providing solutions for:- Wet chemical processing systems (wet benches, electroplating/electropolishing, concentration monitoring, delivery/blending)- High purity fluid heating systems (immersion, inline, point of use, facility, etc.)- Thermal processing (ALD, LPCVD, PECVD, RTP, RTA, RTCVD, plasma, gas purifier, gas abatement, heating elements, hot plates)- Lithography (mask or maskless), Track systems, Spinners- Surface modification (nano-molecular coatings)- Packaging, Assembly & Test * Wafer Level Packaging Services (bumping, RDL, grind/dice/pick) * Test Sockets, Pogo Pins, Probe Cards & Coax Connectors * High speed, high precision die bonders, laminators and remounters (focused on RF and optical applications)- Metrology (3D surface analysis, film thickness, film quality, chem concentration monitoring, particle counting, aspheric and free-form optics, nano and micro analysis of materials (topography, composition, thermal and mechanical))- Cleanroom equipment and supplies- Services (equipment, process and test engineering)- Energy Reduction/Sustainability (solid state lighting, chiller optimization)Specialized Skills:- Leveraging 30+ years of experience to help high technology manufacturing companies maximize their revenues and profitability- Emphasis on high tech, cleanroom-based, manufacturing industries and research and development- Global network of contacts and resources

Tempe, Arizona, Us

Responsible for business development of advanced packaging technology services including: wafer bumping, wafer level chip scale packaging (WLCSP), Cu pillar, integrated passives, redistribution layer (RDL) and die packaging (probe, thinning, singulation, pick to pocket tape, etc.) services. Also involved in capital equipment evaluation, CAPEX and capacity planning, demand forecasting, cost modeling, marketing, customer project management and competitive analysis.

Kalispell, Mt, Us