Work closely with designing team of Stratalight OTS-4000 DPSK products from their infancy to successfully deployment in major carriers networks such as Cisco Systems, Nokia-Siemens, Ciena, and Ericsson.Responsible for define process flow, creating documentation, and provide training for the integration of Stratalight's OTS-4000 C/L-Band 40G DPSK Transponder, Muxponder and Regenerator Optical Subsystem.Principle engineer responsible for transfer internal integration and training of OTS-4000 to outside contract manufacturer (CM) that generate annual revenue of $200 million.PCBA supplier management of all OTS-4000 PBST/DPSK products line. This includes RoHS development for all SMT processes. Debug, repair and functional testing of all PCBA's. Responsible for PCB material selection for telecom and RoHS SMT process capability.Supplier cost reduction and process improvement program to improve product margins.Set up optical fiber splicing process for DPSK products at StratalightExtensive experience in trouble shooting electrical and optical modules including debug and functional testing of PCBA's.Create DFM/DFT guideline for PCBA's at Stratalight

Develop manufacturing process for NPI including DFM/DFT analysis, SMT programming, tooling design, box build assembly instruction, failure analysis reportProvide DFX report to OEM customer using Enterprise 3000 on board layout design and PCBA panelization.Station at OEM's designing team to provide BOM structure, assembly instruction, test instruction for new optical laser system prototype.

Designed layout a wide variety of multi-layer SMT and thru-hole PCBs using Power PCB and PADs design software.Experienced in layout differential pairs, matched lengths, high power, and controlled impedance for high frequency design.

Provide management and technical support of new products Cisco ATM Switch 8850 and 8890 series between design engineering and manufacturing.Provide manufacturing process related DFM/DFT feedback to Design/NPIE/TE for manufacturability, testability, yields improvement, component change, cost reduction, and fab spins.Work with TDE to implement board test strategy including 5DX, ICT, JTAG, Boundary Scan, Diagnostic and Functional test, establishing DPMO targets and TTQV goals for tests at CMs.Proto-type readiness review with CMs includes process flow, proto capacity, and equipment evaluation capability.Implement and manage engineering changes at CMs via ECOs, deviations, and purges.Develop labor model for each assembly and input them for assembly cost verification and cost reduction.Organize and lead weekly defect reduction/value adds teams with CMs to drive yield improvement and cost reduction.Define process quality initiative and monitor CMs performance per DPMO/yield metrics and drive continuous improvement plans.Perform quarterly audit at CM's processes, documentations, and tooling verification.Interface extensively with component engineer in identifies first pass component failure and drive yield improvement actions from vendors.

Develop automated process including machine programming and profiling for all circuit card assemblies.Improve the product in-line process through DOE, SPC optimization; tooling design modification, method improvement, and process characterization.Implement process optimization of circuit card assemblies involving BGA, TQFP packaging.Participate in the development of next generation of Power Processing Unit (PPU) LS2020 satellite circuit card to ensure manufacturability and testability.Implement ECO process and provided manufacturing process instruction.

Implement programming change on In-Circuit tester HP3070, GenRad 2800, and Teradyne 1820.Interface with OEM customer to implement ECO, test related issues.Manage and provide support the transfer of EOM functional test equipment.Provide concurring engineering to OEM customer in PCB layout, PCBA's manufacturability, and testability.Develop and revise production assembly process instructions (MPI), ECO, and quotation analysis for over 300 assemblies.Support concurrence engineering with customer's high density I/O boards (PBGA, CCGA, and CBGA)Knowledgeable in high volume and high mixed, low volume environment.