Responsible for the development of new manufacturing processes for the next generation of piezo-based printheads.

• Key contributor in the qualification of manufacturing tools in a fast paced factory environment.• Roll to roll PVD sputtering and evaporation tool owner. The main contact with the tool vendor to complete implementation of the tool and improve the process and equipment.• Prepare and present reports to all levels from entry level to executive management showing yield and process development and performance to plan.

• Developed tool for waveform design, optimization and performance assessment of the Xerox printhead.• Provided problem solving support to integrate printheads into OEM customer’s systems. • Over 1000 hours using ProEngineer to design mechanical/electrical/software test apparatus to demonstrate printhead capabilities.• Interfaced with manufacturing for printhead build and provided design support work.

Printhead Engineering:• Determined printhead designs to meet the needs of multiple Printhead System Integrators.• 2000 hours of experience in SolidWorks CAD system in development of product designs.• Designed piezo bend mode printheads and systems based on understanding of internal printhead dimensions, fluid dynamics, and waveform design. Various systems utilized oil, water, solvent, UV-curable and solid inks.• Designed printheads to meet the technical requirements. Changes included:- Extensive modifications requiring a new set of product drawings to describe the set of printhead laminates. This resulted in four unique printheads through prototype production.- Smaller modifications to the existing printhead (aperture dimensions, heated or not heated).- A reconfiguration of an existing product such as orientation (side shooting versus down shooting, low resolution versus high resolution), multiple printhead systems, or reservoir set-up.• Modified printhead designs to accommodate supplier production capabilities. For example, worked with R&D to lower plating thickness targets from R&D to improve plating uniformity and to change the printhead design to work within Chemical Etch suppliers’ dimensional constraints.• Assisted multiple system integrators in problem solving printhead integration. • Specified and/or designed prototype and production tooling and equipment. Managed project to bring custom flex to board bonder in house.• Designed and manufactured eight functional demonstration systems for above printhead designs that met customers’ goals.Supplier Qualification:• Qualified six electroplaters, extending their production capability by designing plating tooling and set-ups, measurement systems, and data collection enabling them to move from development into production.• Qualified five chemical etch suppliers, to develop specifications and resolve supply issues.

Management of engineering group consisting of four process engineers and three process technicians encompassing photolithography, etch, thin films deposition and metalization, encapsulation, burn-in and test for the manufacture of electroluminescent flat panel displays.

Developed, improved and documented processes for cleaning substrates, depositing and patterning photoresist, and etching and lifting off thin films.