David Stark Email & Phone Number

Evergreen, Colorado

• Developed and demonstrated the world's most energy efficient double-pane glass unit for windows, doors and numerous other beneficial insulating glass applications.
• Applied for and was awarded (won) two U.S. Dept. of Energy (DOE) grants totaling $3.5M to develop vacuum insulating glass units (VIGUs or VIGs) that would allow building's windows to achieve R-10 insulating values, the.
• Conceived, created and led the first-ever collaboration among the largest North American glass, insulating glass and window companies to have them provide requirements and advice to EverSealed as we developed and.
• Led a diverse cross-functional team of senior engineers and scientists.
• Assembled, tested and demonstrating proof-of-concept vacuum-containment insulating glass units (“VIGUs” or “VIGs”) with an insulating value of R-13.
• Accelerated test methods demonstrated that EverSealed’s VIGs are capable of surviving any climate worldwide for a minimum of 40 years while providing the highest insulation of any dual-pane glass unit.

Evergreen, Colorado

• Electronics Packaging Solutions (“EPS”) provides consulting services for the development and implementation of novel, leading-edge hermetic packaging and production solutions for optoelectronic devices and other.
• Developed permenant, super-hermetic glass-to-metal bonding methods for numerous commercial, military and space applications.
• Conceived several low-cost manufacturing methods to hermetically package reflective and diffractive optical MEMS and other optical and RF micro-devices, for both wafer-level packaging and individual device packaging.
• Consultant to companies seeking simple solutions to complex device packaging problems.
• Inventor and owner of nine (9) issued U.S. patents.

Dallas, TX

• Resolved a critical production issue for Texas Instruments
• Conceived, designed and purchased to specifications a custom, one-of-a-kind automated system to inspect and measure to accuracies of 3 microns (0.00012”), multiple features of Texas Instruments’ Digital Micro-mirror.

Louisville, Texas

• Developed, marketed and implemented advanced electronics packaging capabilities for Texas Instruments (TI) and Raytheon, producing a competitive advantage by increasing system performance and reliability while reducing.
• Team leader and Surface Mount Technology (SMT) advisor for successful company-wide effort to convert from mil-spec contracts, designs and quality standards to commercial designs, standards and practices.
• As cross-functional team leader, redesigned system electronics, converting four mixed-technology military PWBs into two commercial, 100% SMT PWBs to save the JAVELIN Anti-Tank Missile Program $40,000,000. Reduced the.
• Led cross-functional team of process and design engineers that developed and inserted COB packaging technology in the 600 watt, high-density power supplies for the F-16 fighter's radar. Without increasing packaging.
• Leveraged company’s R&D investments 20-to-1 by initiating, participating in, and leading national collaborations with our competitors and non-competitors. Served as Texas Instruments (TI) and Raytheon representative on.
• Led the NCMS Team that developed and demonstrated ink-jetted polymer thick-film resistors for surface and embedded circuit board applications which now saves high-volume users millions of dollars per year in.

Dallas, Texas

• Proposed, implemented and managed the strategy to utilize our department’s excess manufacturing capacity to benefit Texas Instruments.
• Developed and executed the marketing strategies for customers requiring my organization's Surface Mount Technology (SMT) circuit board design, fabrication and assembly services.
• Restructured and transformed business and production operations.
• Coordinated the sales process from quote generation through sales order entry.  - First year contracts awarded were $112,000. Increased second year sales 1,070% to $1,200,000.
• Restructured sales order entry process, reducing cycle time 75%.
• Reengineered production readiness processes, reducing those activities’ cycle time by 50%.

Dallas, TX

• Managed the combined functions of Automation, Industrial, Producibility and Process Engineering for the Micro-electronics Packaging Systems Division of Texas Instruments.
• Designed and oversaw construction of numerous state-of-the-art production DoD military systems’ manufacturing and test facilities.
• Was the Production Engineering Manager for five of these manufacturing facilities.
• Conceived, initiated and managed the function of Producibility Engineering.
• Led the design and re-design of military hardware’s advanced, high-reliability electronics systems.
• Reduced SMT printed wiring board’s first pass defects 95% over 23 months.

Master'S Degree, Mba

Engineer’S Degree, Industrial Engineering