David Stark Email & Phone Number

Evergreen, Colorado

Developed and demonstrated the world's most energy efficient double-pane glass unit for windows, doors and numerous other beneficial insulating glass applications.• Applied for and was awarded (won) two U.S. Dept. of Energy (DOE) grants totaling $3.5M to develop vacuum insulating glass units (VIGUs or VIGs) that would allow building's windows to achieve R-10 insulating values, the same R-value as the walls of new-construction homes. • Conceived, created and led the first-ever collaboration among the largest North American glass, insulating glass and window companies to have them provide requirements and advice to EverSealed as we developed and demonstrated the world's most VIG • Led a diverse cross-functional team of senior engineers and scientists. • Assembled, tested and demonstrating proof-of-concept vacuum-containment insulating glass units (“VIGUs” or “VIGs”) with an insulating value of R-13. • Accelerated test methods demonstrated that EverSealed’s VIGs are capable of surviving any climate worldwide for a minimum of 40 years while providing the highest insulation of any dual-pane glass unit. • Working closely with our patent attorney, awarded six (6) issued patents and have many more pending patent applications.

Evergreen, Colorado

Electronics Packaging Solutions (“EPS”) provides consulting services for the development and implementation of novel, leading-edge hermetic packaging and production solutions for optoelectronic devices and other applications requiring unique hermetic packaging and sealing solutions. • Developed permenant, super-hermetic glass-to-metal bonding methods for numerous commercial, military and space applications. • Conceived several low-cost manufacturing methods to hermetically package reflective and diffractive optical MEMS and other optical and RF micro-devices, for both wafer-level packaging and individual device packaging. • Consultant to companies seeking simple solutions to complex device packaging problems. • Inventor and owner of nine (9) issued U.S. patents.

Dallas, Tx

Resolved a critical production issue for Texas Instruments• Conceived, designed and purchased to specifications a custom, one-of-a-kind automated system to inspect and measure to accuracies of 3 microns (0.00012”), multiple features of Texas Instruments’ Digital Micro-mirror Device (DMD) packages.

Louisville, Texas

Developed, marketed and implemented advanced electronics packaging capabilities for Texas Instruments (TI) and Raytheon, producing a competitive advantage by increasing system performance and reliability while reducing system weight and volume. These capabilities included Chip-on-Board (COB), Ball Grid Array (BGA), MicroBGA and flip chip attachment technologies. • Team leader and Surface Mount Technology (SMT) advisor for successful company-wide effort to convert from mil-spec contracts, designs and quality standards to commercial designs, standards and practices. • As cross-functional team leader, redesigned system electronics, converting four mixed-technology military PWBs into two commercial, 100% SMT PWBs to save the JAVELIN Anti-Tank Missile Program $40,000,000. Reduced the production cost 80% while increasing reliability 100%. • Led cross-functional team of process and design engineers that developed and inserted COB packaging technology in the 600 watt, high-density power supplies for the F-16 fighter's radar. Without increasing packaging volume, added 20% more functions and improved reliability 150%. • Leveraged company’s R&D investments 20-to-1 by initiating, participating in, and leading national collaborations with our competitors and non-competitors. Served as Texas Instruments (TI) and Raytheon representative on the National Center for Manufacturing Sciences’ (NCMS’s) Electronics Manufacturing Group. • Led the NCMS Team that developed and demonstrated ink-jetted polymer thick-film resistors for surface and embedded circuit board applications which now saves high-volume users millions of dollars per year in manufacturing expenses.• Created and led the Raytheon Corp. Technology Council for all engineering functions of legacy E-Systems, Hughes Aircraft, Raytheon and TI companies.• Developed and taught courses on advanced electronics packaging.• Held Secret and Black Program clearances from the DOD and other gov't agencies.

Dallas, Texas

Proposed, implemented and managed the strategy to utilize our department’s excess manufacturing capacity to benefit Texas Instruments. • Developed and executed the marketing strategies for customers requiring my organization's Surface Mount Technology (SMT) circuit board design, fabrication and assembly services. • Restructured and transformed business and production operations. • Coordinated the sales process from quote generation through sales order entry.  - First year contracts awarded were $112,000. Increased second year sales 1,070% to $1,200,000. • Restructured sales order entry process, reducing cycle time 75%. • Reengineered production readiness processes, reducing those activities’ cycle time by 50%. • Held DOD Secret clearance.

Dallas, Tx

Managed the combined functions of Automation, Industrial, Producibility and Process Engineering for the Micro-electronics Packaging Systems Division of Texas Instruments.• Designed and oversaw construction of numerous state-of-the-art production DoD military systems’ manufacturing and test facilities.• Was the Production Engineering Manager for five of these manufacturing facilities. • Conceived, initiated and managed the function of Producibility Engineering.• Led the design and re-design of military hardware’s advanced, high-reliability electronics systems.• Reduced SMT printed wiring board’s first pass defects 95% over 23 months.

Master'S Degree, Mba

Engineer’S Degree, Industrial Engineering