Management of new product development from concept R&D through transfer to manufacturing. Strategic product line planning and road maps. Semiconductor manufacturing equipment product development. Oversight of multinational design teams of various engineering disciplines, program and product managers, materials managers, sales, product quality, manufacturing transfer teams. Controlled staffing, program budgets and spending. Semiconductor RF and DC plasma power supplies, RF match networks, standalone plasma generation products, gas mass flow controllers. Mechanical engineering services group management, setting standards and goals. Established intellectual property boundaries to protect market share.Technical Staff mechanical engineer. Specializing in fluid flow, heat transfer, thermal cycling fatigue of multiple kWatt electronics. Mechanical design of electronics packaging, FEA, CFD. Design for CE, UL and CSA compliance requirements. Thin-film materials analysis and materials science development for plasma processes. Semiconductor plasma processing techniques – PECVD, etch, etc. Solve customer issues with on-site visits, troubleshoot manufacturing process problems, manufacturing equipment issues.

Individual contributor mechanical engineer designing proton beam instrumentation. Heat transfer, stress/strain, corrosion, vibrational analysis, creep design of metals and refractory materials. FEA, CFD modeling. Materials science effects due to high heat, thermal cycling and ionizing radiation. Wire scanners, beam position monitors, gas fluorescence devices.Research of PEM fuel cells with application to mobile devices. PEM fuel cell materials science, polymers, catalysts. Thin film materials deposition (PVD) by plasma processes and analysis of resulting films. Acquired investment funding.

Start-up company, with others, grew company from 4 employees to 40, 0$ to $40M/year revenue. Managed product development teams to create x-ray optics and x-ray spectroscopic instrumentation. Engineering support, sales, product introduction to customers and manufacturing. Achieved funding from multiple sources for start-up company. Heat transfer, stress/strain (FEA, CFD), design of optics and chemical analysis instrumentation. Thin film plasma deposition (PVD, ALD, PCVD), materials science and analysis. Si-based photon detection systems design (diode arrays, CCDs), also PMTs, MCPs, fluorescence-enhanced detection.

Developed incoming inspection techniques for semiconductor manufacturing. Titration, FTIR, laser scattering, etc to inspect incoming fluid and Si wafer quality.