Dennis Thayer Email and Phone Number

SEM FAILURE ANALYSIS (2000 to 2018) - Utilized Scanning Electron Microscopy (SEM), Dual Beams (FIB -focused ion beam), Environmental Scanning Electron Microscope (ESEM), and Bruker Energy Dispersive Spectroscopy (EDS) software in order to conduct analysis of semiconductor parts and materials, contaminations that ranged from dirt, rust to rare and unexpected elements. Basic training for EBSD and TEM sample prep. Lab coordinator for the SEM lab, assisting to identify the proper analysis path, negotiating turnaround and resolving conflict. Developed a mounting stub centering diamond cell directly on the stub, which reduced cutting down time and increased analyzing time when the area of interest was placed in the ESEM environmental scanning electron microscope. Utilized FEI SEM Lab Tools, such as Helios 650, Altura 855, SCIOS, XL30S-2, and Triple Ion Cutter (TIC).

SEM FAILURE ANALYSIS - Utilized Scanning Electron Microscopy (SEM), Dual Beams (FIB -focused ion beam), Environmental Scanning Electron Microscope (ESEM), and Bruker Energy Dispersive Spectroscopy (EDS) software in order to conduct analysis of semiconductor parts and materials, contaminations that ranged from dirt, rust to rare and unexpected elements. Basic training for EBSD and TEM sample prep. Lab coordinator for the SEM lab, assisting to identify the proper analysis path, negotiating turnaround and resolving conflict. Developed a mounting stub centering diamond cell directly on the stub, which reduced cutting down time and increased analyzing time when the area of interest was placed in the ESEM environmental scanning electron microscope. Utilized FEI SEM Lab Tools, such as Helios 650, Altura 855, SCIOS, XL30S-2, and Triple Ion Cutter (TIC). Trained in Mechanical Cross Section creating potted polished samples and precision cross section to a known target, for standard and non-standard samples (utilizing Allied MetPrep 4 Grinder/Polisher, TechCut 5 Precision Sectioning Machine and MultiPrep Polisher). Title promotion from Failure Analysis Technician in 2000.

FAILURE ANALYSIS USING LIGHT MICROSCOPY - Conducted Failure Analysis of semiconductor parts including, developing visual inspection scoring system for reliability testing and inspecting parts with accelerated testing to track failure modes and progression of failure with quantitation. Utilized quantitative numbers from degradation in mathematical models of failure or for reliability prediction. Oversaw the reliability grading lab. Accomplishments include, but not limited to: - Developed optical inspection methods (Dark Field, Differential Interference & Contrast/DIC, Cross Polarization and Bright Field) for new products, including developing and designing customized tools for these methods and shared world-wide (and still in use today).- “T Grading” method was named after me and the tools I developed for degradation processes that are still used to this day at HP sites in the United States and overseas.