D.J. Trieb Email & Phone Number

Oregon, United States

Phoenix, Arizona Area

Responsible for the development of wire bond, die attach, and component attach processes for laminate BGA products. I work with the design team, product engineers, as well as operations to introduce and release new products to production of next generation DDR4 memory products. I am also responsible for maintaining existing processes as well as identify opportunities to improve throughput and reduce yield loss on the production floor.

Tempe, Az.

• Develop and assemble processes for customer products • K&S Iconn ball bonder – program and maintain • Gold, silver, and copper wire ball bonding .5-2.0 mil• K&S 8090 wedge bonder – program and maintain • Gold and Aluminum wedge bonding 1-2.0 mil• Set-up and operate manual ball and wedge bonders• Program and operate automatic pick & place machines• Set-up and operate manual pick & place die bonders• Troubleshoot and repair of various equipment• Communicate… Show more • Develop and assemble processes for customer products • K&S Iconn ball bonder – program and maintain • Gold, silver, and copper wire ball bonding .5-2.0 mil• K&S 8090 wedge bonder – program and maintain • Gold and Aluminum wedge bonding 1-2.0 mil• Set-up and operate manual ball and wedge bonders• Program and operate automatic pick & place machines• Set-up and operate manual pick & place die bonders• Troubleshoot and repair of various equipment• Communicate with customers over process issues• Observe all ESD, cleanroom, and safety procedures • Inventory control of customer’s product• ESEC 3000 series ball bonders - program and operate • Quality assurance Show less