贯彻执行公司的经营战略和经营计划；制订公司新产品、新技术研发计划；发展和建设研发中心队伍；建立和完善研发制度；改进产品开发流程，提升产品质量；

 Design SVT ATE architecture, lead team to develop CI (Continuous Integration) system (about 700 files, 84K lines code) include functionality and performance validation, complete chip system’s level verification from FPTA prototype to mass production chip. Lead team develop OPL1000 SDK (software development kit) and reference. Design SDK/Reference ATE architecture, lead team to develop CD (Continuous Delivery) (about 200 files, 47K lines code) system, take charge of release package publish to Github.  Lead team to develop tools such as download, pin-mux, mass production tool etc (about 60 files, 55K lines code). Designed all tools’ architecture and key modules. Technique support for key customers in Eastern China; Help customer implement mass production.  Cross-team collaboration with US, Taiwan and Shenzhen sites.

 Leaded team re-factoring IBAT1x00 UHF RFID receiver chip software (include firmware, driver and host APP). Develop RFID Ad-Hoc Network prototype based on ZigBee technique.  Defined software architecture for iBAT2000 SOC chip (integrate ARM cortex M3 MCU core), ), lead team design iBAT2000 SOC chip SDK and validate reference design. Develop key technique and architecture of IBAT2000 ATE platform, lead team realize ATE SW.  Took charge of FAE team to solve customer technique issue.

 Worked on SDN(Software Defined Network) based dynamic resource scheduling system research and design. Completed a SIP loading balancer prototype development based on Centech V150 OpenFlow switch and Ryu open source lib. This prototype is developed by python language.

 Leaded team to complete MxL SOC chip driver and application software development and maintenance work, supported customer to integrate MxL chip, solve customer SW issue. Leaded team to complete SOC chip function, performance validation and optimization. Helped customer validate and optimize their solution. Coordinated Shanghai with U.S, India team to work on terrestrial, cable and satellite product lines smoothly. Successively attended ATV DVB-T，ISDB-T,DVB-C 5 kinds of chips’ software development work on both Windows and Linux platform.

 Designed mobile TV front-end module based on ADI Tuner and Legend Silicon Demodulation chip. Developed reference design driver and application software. Established automatic test suite to verify, debug and optimize performance. Responsible for document writing and customer technique support.

 Responsible for product development plan scheduling, feature defining and R&D flowchart and quality improvement. Coordinated chip design, cross-dept work, assisted field test work for 3rd generation chip VikingII IC and L1. Leaded team to realize physical layer software based on 2nd generation chip which support 384kbps high data rate service. Responsible for system software architecture design, SW/HW partitioning, interface design, power management and system issue debugging. Participated in 3 projects physical layer algorithm development work, including float point, fixed point simulation link design, physical layer algorithm research, 3rd part IP evaluation, ASIC chip module test spec writing and high layer software integration. Responsible for technique training, people recruit and team building as ALG & SYS department leader.

 Developed TSM test mobile based Ti OMAP platform by realizing high data rate service, such as MPEG4/H.263, building receiver and cell search fixed-point simulation link based on C. Responsible for design and simulation work for TD-SCDMA physical layer algorithm. Implemented PL algorithm based on TiC55xDSP. Researched G.729 audio coding that based on TMS320C54X, pre-researched 3G TD-SCDMA. Attended China TSM standard specification drafting work. Responsible for overall scheme design, supplement service for GSM/DCS1800 dual frequency project.