Dongsoo (Ray) Moon Email & Phone Number

대한민국

Regional Sales Manager - OSM Korea

대한민국

● Application engineer for SAT (scanning acoustic tomography) technology for stacked wafer product (TSV) for top tier memory manufacturer, Samsung Electronics & SK Hynix.● To understand customer’s target package structure & define technical needs of defect mode, spec criteria and productivity for providing best optimized solution for non-destructive package inspection.● Working as a local engineering PM for new machine launching project and leading technical discussion with customer for new project engagement.● Mainly working on the most high-end automated machine for wafer-level package. All other manual machines are handled by local distributors.● 300mm, 8stacked wafer TSV product, Min 75um mold void detection in automated production.● Set automated scan image analysis AI program with SK Hynix.● Proven record of successful new business engagement with SK Hynix – 3 sets of the most high-end automation product for 2 years.

대한민국 서울

Seoul, Kor

● New package & module development. Launching and qualifying NPI programs, managing mass production performance in subcons and module assembly houses.● Monitoring and continuous improvement of production yield performance & quality. Trouble shooting for top defect modes, run cost reduction items, manage engineering change items, document control – FMEA, control plan, process spec, working instructions for robust production management. ● Focused on capacitive type sensor module process: EMC molding & grinding, SMT, ACF attach for FPCB, sensor coating process. ● Ultra-thin sensor profile: EMC & solder ball grinding for improving ACF process quality.● Projects: Focused on the fingerprint sensor for the laptop PC & smartphone a. Laptop PC Applications: Lenovo Storm, Yoga Book (touch sensor, flexible PCB module) b. Smartphone & Tablet PC Applications • SONY: 2H2018 Flagship Model (touch type sensor, FCBGA module) • Kyocera: 2H2018 Model (touch type sensor, FCBGA module)● Accountable OSATs & Module Assembly Houses a. Module Assembly: Partron, Dreamtech, Crucialtech, MCNEX, Suntel, JYT (China) b. OSATs: Signetics, Hana Micron

Seoul, Kor

● Subcon Production Management a. Focused on multi-stack die packages, memory device, DRAM, NAND Flash b. Robust production management – Monitoring and improving yield performance, troubleshooting top defect modes, on time delivery, managing engineering change items and quality document. c. Managing NPI programs – Run evaluation and qualification build, monitoring production performance, document control – qualification report, FMEA, control plan, work instruction, process specs. d. Managing engineering change item (PCN) – Set qualification plan, run evaluation and qualification build, monitor yield performance for SVM & HVM. e. Quality improvement – Continuous improvement for top defect modes, handling quality issues, maverick lot and managing 8D report for taking containment action, finding root cause, set corrective & preventive actions, and monitoring implantation, monitoring SPC, supporting SQE for process audit. f. Regular visiting subcons for onsite support (domestic & international). g. Mainly responsible for STATSChipPAC Korea / Amkor Technology Philippines● Key Engineering Change Item a. Factory transfer from STATSChipPAC Korea1 to STATSChipPAC Korea3 (new site in Incheon). b. Successfully qualified total 29 products (stack die FBGA, POPt, PIP, LGA) without schedule delay. c. POP Top (DRAM + NAND) : Solved warpage issue with die thickness modification. d. PIP LGA Packages (2 NOR BGAs) : Solved metal layer crack on thin stack die package through die attach process parameter optimization.

Seoul, Kor

● IC Packaging Development a. Wafer Backgrinding/Dicing Saw: Ultra-thin wafer (≥50㎛) process & material development b. Die Attach: Ultra-thin die (≥50㎛), WIF (wire in film), interposer attach process & materials c. EMC Molding MUF (Molded Underfill) & material (mold compound) for flipchip BGA. d. Knowledge & Skills: Statistical data analysis, reliability test, various failure analysis technics (destructive & non-destructive), set DOE & run evaluation, defining root cause. e. Document Control: FMEA, technical report, control plan, work instruction, process spec, 8D report f. Deep understanding in IC package development procedure (PDP) – Market research, Feasibility study, characterization, qualification, validation & production transfer, HVM.● Technology Transfer Management Team a. Responsible for managing development status of key R&D projects, transferring the qualified project to the production team. Monitoring yield for robust volume ramp-up. b. Monitor development quality of key R&D projects – the key deliverables per development phase, PDP. c. Monitor production performance per target yield per stage (SVM to HVM) and troubleshooting the critical defects.● Multi-stack Die BGA Package Team a. Ultra-thin die (≥50㎛) packaging solutions for multi-stack die BGA for memory packages b. Qualified various types of stacked-die package projects – memory devices. c. Qualified 50㎛ die thickness + 10㎛ film thickness for 5 stacked die BGA

Master Of Business Administration (Mba), Business Administration

Bachelor'S Degree, Electronic Material Engineering