- Optimized ASIC data processing efficiency by 40% through modifications to Python scripts.- Analyzed and tested ASIC chips in varied conditions, leveraging the data communication capabilities of the FPGA front-end board to ensure robust functionality.- Trained new hires in warm chip testing, safety protocols, and troubleshoot procedures.- Revamped and updated manual documentation for troubleshooting and testing procedures, streamlining information for improved accessibility and clarity.- Compiled and distributed test parameters for chips, identifying outliers to enhance the precision of chip testing processes.- Prepared the Bill of Materials (BOM) for lab safety equipment, basic tools and equipment, electronic components, and assembly.- Provided regular status reports on the production testing of ASIC chips.

- Designed and integrated an op-amplifier pressure sensor into the Balloon Payload utilized to detect altitude using Altium and LTSpice to simulate expected threshold value.- Collaborated and developed automated optical inspection tool with nanometer-level precision, detecting misalignments in surface mount devices (SMD) with ImageJ and MATLAB. - Assisted researchers in department with electrical/mechanical wiring, 3-D prints, and PCB.- Troubleshooted and repaired department-requested electronics using power measurement tools like Oscilloscope, digital multimeter, and ESR capacitor tester.

- Designed 3-D print molds in Fusion360 tailored for printed circuit boards to optimize soldering efficiency.- Conducted circuit analysis, PCB documentation, and test procedures to repair department power equipment - Documented project development of fabrication, assembly, and testing- Accurately soldered 0201 surface-mounted components onto PCBs with precision and ease