Medical Device Design Assistant (Returning)
Performed root cause analysis and presented solutions to mechanical assembly adhesive debonding. Developed and executed testing scheme for alternative adhesives and assembly techniques for resilience to: impact, maximum expected pressure during production testing and in-situ, as well as axial and rotational stress, incorporating aging and sterilization effectsInvestigated and resolved EEPROM misalignment resulting in unusable assemblies. Performed tolerance analysis of multi-variable interface to determine worst case pin-to-pin distance variation. Developed, tested and implemented improved manufacturing technique for catheter side EEPROM assembly. These changes reduced cost of any failed or scrapped products by ~$100 and improved yield from 75% to 95% at final in-process checkCompiled and finalized ultrasound transducer Solidworks models and drawings for production