• Point person for electronic component development & qualification.• Spearheaded component strategy and roadmaps.• Formulated development & qualification processes for electronic components and trained worldwide teams.• Engaged with key suppliers on new component developments.• Led the engineering team's biannual performance scoring of 15-20 suppliers.• Worked cross-functionally with Systems, ASIC, Memory, Supplier Quality, and Procurement teams.

• Responsible for architecture, design, characterization, and integration of sensors for HDD, including shock, rotational vibration, acceleration, pressure (altitude), humidity, and temperature sensors.• Developed performance requirements and partnered with leading MEMS companies to evaluate emerging technologies and develop novel sensors for hard disk drives.• Architected mixed-signal circuits for sensor systems and engaged with external vendors to implement circuitry in custom ASICs.• Created schematics and PCB layout guidelines for low-noise sensor circuits.• Member of internal Internet of Things (IoT) development team, as well as the Invention Review Board for Power Regulation, Spindle/VCM Control and Shock Mitigation.

• Designed and fabricated a miniature atomic gyroscope prototype, based on NMR principles, with supporting control circuitry.• Conceived and demonstrated a wafer-level glass blowing technique for batch fabrication of microscopic spherical gas confinement chambers for atomic gyroscopes.• Devised and fabricated a MEMS piezoresistive accelerometer with minimal temperature drift.• Developed a micromachined optical accelerometer based on Fabry-Perot interferometry.