Growing and developing the team responsible for building and delivering best in class electronic medical devices.Focused on scaling a robust and profitable supply chain.Plans and executes new product roadmap.Ultimately responsible for solving any and every problem related to design, software, and manufacturing.

-Solves any and every technical problem limiting growth. SME for selective soldering, wave soldering, automated visual inspection, non-newtonian fluid dispensing, silver sintering, electrical testing, automated optical inspection (AOI), automated x-ray inspection (AXI).-Drives quality, throughput, and cost optimization by building systems to collect and analyze massive datasets related to manufacturing process. Turns data into insight and insight into action. (Python, SQL, six sigma, machine vision, statistical process control, machine learning to model process interactions)-Owns process control and automation of electrical assembly of power inverters (Tesla Model Y, Cybertruck, Semi)

-Anticipates and mitigates risks to yield and timeline by verifying designs are realistic, schedule checkpoints are met, processes are under control, and most importantly, communication is crystal clear.-SME for backend packaging and assembly processes (dicing, flip chip, soldering, wire bond, underfill, welding, encapsulation, etc)-Works with cross functional team to translate system level and internal customer requirements to module specifications, set up manufacturing process flow, resolve production issues, and improve lead times-Plans build schedules and logistics for prototype builds including line bring up, new process validation, clear to build checklists, etc.-Owns yield improvement activities, statistical process control, continuous improvementOptical Metrology Engineer:-Test and characterization of LED displays: interpret requirements, design tests, specify test equipment, program automation, analyze data, account for error, presents results/recommendations.-Photometric, radiometric, colorimetric, and spatial performance test methodsResearch project:-Process development of novel bonding technique for ultra fine pitch interconnects-Wire bonding devices with 'extreme geometric challenges'-Rapid prototyping electro-optic devices

High mix production environment for PCB assemblies and backend packagingHands on experience in soldering, fluxing, pick and place, flip chip, cleaning, underfill, AOI, testing.Focus on yield improvement for early stage products with strict requirements: medical, military, space, aviation, biotech, image sensors, MEMS, etc.Create and execute a technology roadmapPartner with suppliers and customers to maximize valueIdentify and lead yield/quality improvement projectsDesign custom tools and fixtures Experience with wire bonding, die bonding, thermal adhesives, underfill, hermetic sealing, laser welding, electrode welding, material characterization, FMEA, DOE, IQ/OQ/PQ, lean/six sigma

Owned yield & throughput improvement activities for reel-to-reel organic coating process.Capital projects, equipment specification and acquisition, efficiency studies, project planning

• Responsible for minimizing bacterial contamination of food-grade products in the fermentation stage of production. • Optimized cell growth by continuous in the field troubleshooting of equipment and process streamlining.• Responsibilities include detection of possible sources of contamination and carrying out or delegating preemptive repairs, supervising operators to ensure that proper cGMP requirements are being met, coordinating schedules between production and maintenance departments to complete all required preventative and corrective maintenance while reducing wasted man hours. • Constantly working together with downstream engineers to resolve product quality issues• Involved with various cost saving projects to improve efficiency of equipment and reduce waste.• Some experience with distillation systems• Daily use of SAP and PI processbook, proficient with ASPEN

School of Infantry (west) optics section head:• Honorable discharge at rank of Sergeant. Led teams ranging in size from two to twenty-five Marines. • Achieved and sustained 100% accountability, security, and readiness of more than 7,000 optical devices worth over $15 million. • Reduced cost to the unit on a mandatory equipment upgrade from $38,000 to $6,000 by repurposing unused parts. • Implemented new storage systems that saved countless man hours by organizing assets and streamlining distribution, recovery, and repair procedures. • Forged strong working relationships with Marines of higher, lower, and equal rank that increased cooperation among groups with different mission objectives.• Responsibilities included maintaining repair orders and requisition forms, ensuring sufficient stock of repair parts on hand, tools, and collateral equipment, tracking shipments, resolving warranty issues. • Additional training and experience in logistics, maintenance management records, safety and hazardous waste storage and disposal, martial arts instruction, infantry weapons repair and operation, supply operations, and first aid.3rd Battalion 4th Marines Electro-Optics tech/chief• Served two combat tours in Iraq as part of Operation Iraqi Freedom. • Duties include carrying out detailed inspection and repair of electronic and optical devices in accordance with technical publications and keeping records documenting all work done. • Promoted to leadership position ahead of schedule. • Job proficiency with complex diagnostic equipment and calibration instruments as well as hand tools. • Secret security clearance