9 years work experience in memory testing development engineering in the Semiconductor industry (ASX-51/Future suite Program coding/ New tester evaluation/ Testing Engineering/ Probe Card wiring/New product transition/ Application Support SDRAM /LPDDR3 /Async. SRAM). Created new test program for mass production of new product. (high parallel, dual mode,...etc.) Define MRA and generate solution decode to fuse code program. Build up new E-fuse zapping, and soft E-fuse program. Develop cell condition for fail bit map tool. Fine tune test spec for yield gain. New DRAM/SRAM family characteristic test program build up. Reduce test time by new design for testing to save testing cost. Provided technical and application support to reliability test. Identified and developed a new Sort and new Package test program for DRAM/SRAM related products for Advantest T53xx or T55xx series. Develop 4Way/2Way/1Way speed patterns for LPDDR3 package. Support production line yield lost issue and release hold lot.
Listed skills include 半导体行业 and 半导体.