• Technical project lead for high-speed optical sub-assemblies (OSA) development projects. Responsible for the definition of opto-electronic specifications based on customer input and developing standards. Applications range from Datacom to long haul coherent optical transmission including advanced modulation formats.• Work closely with both internal and external active component suppliers to develop the necessary Rx (photodiodes/trans-impedance amplifiers) or Tx (laser, driver, modulator).… Show more • Technical project lead for high-speed optical sub-assemblies (OSA) development projects. Responsible for the definition of opto-electronic specifications based on customer input and developing standards. Applications range from Datacom to long haul coherent optical transmission including advanced modulation formats.• Work closely with both internal and external active component suppliers to develop the necessary Rx (photodiodes/trans-impedance amplifiers) or Tx (laser, driver, modulator). Guide the overall development of the working closely with mechanical, RF design, and process engineers. Specify the development/production test requirements.• Current work on 980nm High-Power Pump Laser Show less

• Responsible for developing of high-speed miniature optical transmitter-10Gbps XMD TOSA, including prototype designing, material sourcing, optoelectronic packaging, reliability qualification,related engineering techniques and NPI to production line for mass production.• Developed wavelength-shift control technique for DWDM transmitters, zero wavelength-shift for 10Gbps TOSA and EML.• Developed thermal and coupling technique for miniature packaging to obtain low power assumption and… Show more • Responsible for developing of high-speed miniature optical transmitter-10Gbps XMD TOSA, including prototype designing, material sourcing, optoelectronic packaging, reliability qualification,related engineering techniques and NPI to production line for mass production.• Developed wavelength-shift control technique for DWDM transmitters, zero wavelength-shift for 10Gbps TOSA and EML.• Developed thermal and coupling technique for miniature packaging to obtain low power assumption and high optical coupling efficiency. • In charged of characterization on laser diodes chips, including chip burn-in, screen test, reliability qualification. Improved burn-in setup suitable for different type of EML, DFB chips. • In charged of developing optoelectronic butterfly packaging techniques to meet different technical requirements of international/domestic clients.• Established the whole optoelectronic packaging technical guideline and workflow, standardized the packaging procedure.• Developed 10+ types of laser package designs, such as 10G/2.5Gbps direct modulated DFB Laser, SOA-DFB Laser, Tunable EML, 1653-1665nm BUT/DIL Laser, 14pin 1370nmDFB, 2.5G DFB -TOSA, DBR laser, J-waveguide flip FP laser, and meet the specs.of customers.• Managing R&D of 10Gbps MSA optical receiver and microwave performance improvement of 10G GPO-EML optical transmitter. • Designed and fabricated 49 degree lensed fiber with side-coupling efficiency 95%, and obtained 92% responsivity of 10G Rx using grinding method.• Developed 10G Rx with good performance of sensitivity, BER, 3dB bandwidth, optical overload and won an award as first prize for Science&Technology Progress of Dalian in 2009.• Designed the universal chip submount for high-speed GPO and miniature transmitter, optimized GPO layout,and improved screen yield of EML chips. Show less