Eric Lee Email & Phone Number

*New technologies survey, products system architecture development, including system block diagram, key component survey, power distribution to meet product spec.*Lead NPI products and EE tasks distribution.*Hardware design/test matrix/test report review.

Guishan

*Integration knowledge of Thunderbolt/USB DAS(Direct Attached Storage), Mobile Array/RAID storage, 10Gbe NAS(Network Attached Storage), Thunderbolt/USB docking station product.*Experience in architecting embedded systems (selecting SoCs, memories, power distribution)*Drive circuit designs & schematic capture*Work with peripheral interfaces (PCIe, USB, SAS/SATA, Ethernet, I2C, SPI, UART, SPI)*Proven tracker of succeeding in power electronics: USB PD 3.0, Buck-Boost, Buck, LDO, PMIC*Strong knowhow of PCB layout and construction (Signal Integrity, Power Integrity)*Create and execute plans to bring up & validate designs*Debug and support prototype builds. Analyze failures; drive process and design improvements

台灣 台北市

FA(Failure Analysis) team leader:Experience of audio products(Apple HomePod, AirPods 1st generation) failure analysis. Lead FA team in the HomePod project, quickly identify issues and assign the tasks to the corresponding owner to resolve. Coordinate the daily meeting with customers, and collaborating cross-functionally with PD, Acoustics, FW, SW, PE, SMT teams to drive process and design improvements. Test station DRI(Directly Responsible Individual):During supporting AirPods, responsible for the functional test station, familiar with tester reliability validation, loop test, blue tape test, GRR (Gauge Repeatability and Reproducibility), and alarm exclusion.SI/PI validation:Experience of HomePod SI/PI validation, issue record.Tester PCB and validation software development:Experience of tester PCB and function junction board design, PCB layout, BOM.Experience of programming the auto-test software to integrate the audio analyzer (APx 500 series) API by using the LabVIEW.