1.Lead Sales, Marketing and Operation teams.2.Accountable for the sales, distributions target for China. 3.To identify new business opportunities on a on-going basis by market intelligence collection and product-line extensions.4.Carries on the goal market to subdivide, localization goal market, choice appropriate strategy plan.5.Set up supply chain strategy plan according to company annual sales & manufactures plan.

1.Lead Sales team for cover China and Taiwan business.2.Responsible for Flash Memory business in Greater China.3.Dig out strategic plan, new customer, new technology and Marketing information collection.

1. Responsible for product promotion, market penetration, technical support, strategic planning, and managing distributors to create more new business and to seek opportunities.2. Managing product cost down through research, finding new wafer and new packaging suppliers.3. Lead Marketing & FAE team.4. Report directly to the President and CEO. Work out plan for help Sales team to reached the goal.5. Acheieved design in/ design win business order in OEM/ ODM main customersand Global account.

1. Design-in new platforms and created more opportunity in potential OEM/ODM customers (EMS, CE, Networking, Mobile Communication, etc). 2. Conduct market research, new application and target segment analysis, and competitor analysis.3. Report directly to the President and CEO. Acting as technical advisor and trusted consultant to senior management to advocate strategies going forward. 4. Main function is to increase OEM/ODM business by rely on close relationships and experiences with EMS and Chipset vendors. 5. Lead product promotion, presentation, strategic partnership, and seek opportunity.

1. Responsible for all products support in Spansion, except the embedded product. Area of focus includes high volume networking product, consumer electronics, PC, and communication. 2. Lead and supervise the product promotion, market penetration, technical support, strategic planning, and managing distributors to create more business and to seek opportunity.3. Acted as the technical window between customer and company sales.

1. Responsibilities including managing tier one accounts and managing local AMD distributors assist them with production promotion, introduction and presentation of applications, technology and roadmap. As well as distributor’s training and weekly business/project review. 2. Lead and supervise all technical issues related to AMD’s memory group. Mainly focusing on applications of flash memory (NOR/MCP) in markets of cellular phone, PC, networking, and consumer electronic products.3. Pre-sales job function.

1. Acting STEC product promoted (Memory card, DRAM Module, HD..) and dig out new opportunities in Taiwan. Product technical support for white label customers (TW/China module house..) and strategy key account. 2. Over five years experience dedicated to AMD product lines (CPU, Embedded Process or 16/32bit CPU, SoC, Peripherals chip, Networking chipset, etc). Mainly focusing on application of flash memory in markets of broadband, networking, DSC, PDA, and consumer products. 3. Lead the company to become AMD’s number one distributor in Taiwan. Acting as the Product manager, responsibilities including product promotion at design-in phases, strategic product promotion, critical strategic planning, as well as Sales/FAE training. 4. Coordinate and drive sales-to-customer interface with more than five year of extensive customer relationship, product knowledge and technical support. 5. Involved AMD CPU retail market product promotion contain sales & technical support.

Duties include technical support for series of NEC ASIC semiconductors and acting as interface among local customers and Japanese vendor. Responsible for technical support and the promotion of NEC semiconductor product line in Taiwan.

Responsible for design and implementation of Japanese audio/video electronic products. Served as bridge to Tokyo R&D center to coordinate design spec, issues, and detailed production process.