Eric Wei Email & Phone Number

Working Experience: WINSTEK (台星科) --------------------------------------------------------------------- 2021.12~ Present Title: Project Manager of Flip Chip Integration Products in Charge of: FCBGA, FCCSP, FCLGA, WLCSP Customer in Charge of: Bitmain, Seffi, MKSEMI, Alchip Job Responsibility: I. PM of NPI: Flow: CDIQ->Feasibility &TRA->RFQ->Drawing->Tool/BOM prepared->Parameter Setup-> Confirmation Run ->Qual->LVM->HVMII. Weekly Meeting with Customer; Audit; QBRIII. Contol Plan & FMEA MaintenceIV. Product YieldV. EDN; MRBVI. PCNVII. Annual of ProjectVIII. CCB  Achievements:I. Bitmain  BM1398, ED-FCLGA(CUF) 8x8m2, HVM (1M/month), Ass’y Yield >99.9%  BM1362, ED-FCLGA(CUF) 6x6m2, HVM (2M/month), Ass’y Yield >99.9% BM1366, ED-FCLGA(CUF) 6x7m2, Qual PassII. Seiffi CASSINI2, HS-FCBGA 45x45mm2, HVM (0.4K/month) Ass’y Yield >99.9% SHU1, ED-FCLGA(CUF) 11x11mm2, HVM (1M/momth), Ass’y Yield >99.85%III. MKSEMI MK8000, MCM-FCLGA(MUF) 4x4mm2, Qual Pass MK8001, MCM-FCLGA(MUF) 5x5mm2, Qual Pass MK8002, WLCSP 2.91x2.43mm2, Qual PassIV. Alchip MPU3, FCCSP(CUF) 10x10mm2, Qual PassV. AOP PKG Traceability: PKG ID by Laser Marking 2D Matrix Code SMT Line Build Up WINSTEK (台星科) -------------------------------------------------------------------- 2017.11~ 2021.11 Title: Manager of Flip Chip Div. Process in Charge of: Flip Chip Bond; Flux Clean; Undrefill; Heat Sink; Molding; Laser Marking; Ball Mount; Singulation;Open&Short; Lead Scan Product in Charge of: I. FCCSP, Cu pillar BumpII. FCLGA, Cu pillar BumpIII. FCBGA, Solder Bump/Cu Pillar Bump Customer in Charge of: Canaan, Faraday Subordinate: 10 Persons Job Responsibility: I. PM of Flip Chip Line Build UpII. Clean Room Layout PlanningIII. Machine; Material and Tooling Survey & EvaluationIV. Engineers RecruitmentV. System PlanningVI. SPEC/Document Created

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  輔仁大學

  Chemistry