Eric Weng Email & Phone Number

Neihu District, Taipei City, Taiwan

Responsibility– Lead design and development of lab accessories and Echo from concept to production.– Collaborate with cross function teams such as PM,ID and other engineering teams to ensure the design meet customer requirements and manufacturability.- Successfully managed [number] projects simultaneously, delivering on time and within budget.Achievement/Awards- Successfully managed 3 projects simultaneously, delivering on time and within cost guardrail and launched one stylus, two adapters and one charging stand.

Hsinchu City, Taiwan

Responsibility– Mainly responsible for JDM projects development and as a ME design lead for music products (PC speakers, mobile speakers and headsets). – Product architecture concepting and feasibility evaluation from ME perspective (mainly communications between ID/Marketing and engineering)– 2nd source factories bring up in SEA for “Out-of-China” strategyAchievement/Awards- ME lead for the first UE speaker development in Asia- Fabric wrapping process development and +/- icon integration- Water proof (IPX67) design and manufacturing implementation.- 2nd source factories bring up in SEA due to “Out-of-China” strategy- Best Bluetooth speakers for 2020 by CNT (WonderBoom & WonderBoom2)

Taoyuan City, Taiwan

Responsibility– Be an engineering account manager to Nvidia– Develop a PM team and lead 3 ME development teams to handle Nvidia projects. Directly report to BU VPAchievement/Awards- Bring JDM working model into Foretech and leading the first JDM project in Foretech- Lead RD/PM and other function teams to develop two projects successfully. (Tegra note and Shield series products)

Hebei, China

Responsibility– Responsible for mechanical parts development for Nokia (Ulm, Germany) and hTC.– Product ESI evaluation and process definition discussion.– Coordinate RD, NPI team and manufacturing factories for better yield and process. (X-function communications)– New product introduction and production line transfer for oversea factories planning and optimization.– Lead 6 staffs and reported directly to R&D Director.Achievement/Awards- Successfully launch hTC oneX and oneX+ and create 2M shipment within 3 months.- Process yield and dimension control for diecasting and metal CNC chasis- Successfully bring FIH into Meizu's supply chain as an important EMS partner.- Win the “The best engineer of the year” award from Foxconn technology group in 2010.

Shenzhen, Guangdong

Responsibility– Mechanical parts design (2D/3D drawing) and tolerance analysis– Issue analysis and action set-up and follow– DFM, FMEA, SOP and SIP documentation review– Manufacturing process review and yield/parameter optimizationAchievement/Awards- Join product development team for Nokia 3110, 6303, 6303i and asha311 and lead the parts/project smoothly to mass production. - Win the “High-talented engineer” award from Foxconn technology group in 2009.

Master'S Degree, Mechanical Engineering

Bachelor'S Degree, Mechanical Engineering