Christopher Brannon Email & Phone Number

Allen, Tx, Us

Sm1 Sherman, Texas

Dallas/Fort Worth Area

Eric Brannon is a proven technical leader, evidenced by his election to Senior Member Technical Staff in 2019 at TI and in 2009 at Spansion/AMD. His 9 publications, 2 patent, 3 patent application and global technical leadership positions at AMD/Spansion/TI for the past 25 years have established him as a recognized technologist in the field of chemical-mechanical planarization.

Dallas/Fort Worth Area

Receives assignments in the form of objectives with goals and process to meet goals outlined. Provides direction to employees according to established policies and management guidance. Work is reviewed by management to measure meeting of objectives. Administers company policies that directly affect subordinate employees. Recommends changes to unit or sub-unit policies. Erroneous decisions or failure to achieve results will cause delays in schedules. Frequently interacts with subordinate supervisors, outside customers and functional peer groups at management levels. Interaction normally requires the ability to gain cooperation of others, conducting presentations of technical information concerning specific projects/schedules, etc. Provides general supervision to lower level supervisors and direct supervision to exempt employees and/or skilled nonexempt employees (i.e., engineering, technicians).

Dallas/Fort Worth Area

Technical EffectivenessExpert in analytical techniques, methods of troubleshooting, and the interpretation of the results. Anticipates new developments and challenges faced in other functional areas and how they might affect his/her position. Effectively participates in cross-functional teams, and may lead teams, to solve critical and complex issues. Actively mentors new employees to accelerate their development. Identifies and implements innovative ideas (includes patents). Engages in external information exchange through outside publications, conferences, societies, and symposiums. Behavioral CompetenciesResolves interpersonal and interdepartmental conflicts with limited intervention by management. Leverages professional relationships to stay abreast of current/changing external customer needs and to obtain information which improves internal processes, tools, equipment, and products. Acknowledges individual and cultural differences when implementing changes, solutions, and creating teams. Focuses team on key objectives, mobilizes inter-department individuals to take action, influences external factors to achieve desired goals, and leads projects to a successful completion. May publish external papers or articles. Business ImpactAbility to achieve results has a long-term impact to the organization. Responsible for Strategic Initiative implementation and assisting in some strategic plan development. Products/Processes/Projects may involve and/or be used by multiple groups/depts/organizations. Significant contributor to our recruitment efforts through interviewing, talent identification and referral.

Responsible for development of new or modified wafer fab process formulations, definition of processing or handling equipment requirements and specifications, review of processing techniques and methods applied in the manufacture, fabrication and evaluation of semiconductors. Reviews product requirements with design staff to ensure compatibility of processing methods. Recommends and prepares changes, additions, and modifications which will facilitate manufacturing. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. Conceive and plan projects involving definition and selection of new concepts and approaches in the processing or development of new or improved processes in CMP, wafer fabrication, and device physics. Follows standard practices in analyzing situations or data from which answers can be readily obtained.

Defined and wrote process specifications and work instructions for wafer fab area, wrote preventive maintenance specifications for process and metrology tools, wrote reports detailing all experiments performed. Evaluates and recommends the selection of new process equipment. Oversaw the installation, acceptance and qualification of equipment. Tests and fully characterizes new equipment or processes using Statistical Design of Experiment (SDE) techniques, utilizing technical skills investigates and develops improvement to equipment and processes to increase quality, reliability, and yield.. Develops and implements process solutions through analysis of data using statistically sound methods. Training guides and directed less experienced Manufacturing Engineers, assisted technicians in resolving problems and in sustaining production and quality.Implemented 90nm Copper processing on Speedfam Auriga Platform, developed and analyzed new copper Slurry for this process.

Analyzed and resolved a variety of complex technical and operational problems involving product and equipment issues on the production floor that might compromise product quality, yield and throughput. Performed statistical analysis of process trends, analysis of automated process control functionality, capacity modeling, troubleshooting of product and equipment failures, and project work using designed experiments geared towards process improvement. Responsible for CMP Copper and BEOL Integration manufacturing process areas. Developed new Cu Speedfam and Mirra Mesa Polish Process and implemented into production.Developed best know Methods for closed loop control and advanced process control for Cu CMP.Reduced the edge exclusion for thin films measurement of all logic and flash memory products. Integrated the new measurements sites into the manufacturing process, which resulted in a 13% improvement in process monitoring.

Lead engineer on shift in the Chemical Mechanical Polish (CMP) module.Performed continuous process improvement experiments and consumable evaluations. Implemented new procedures and process changes.Defined and documented isory activities included: perform all shift operational responsibilities during absence of manager, assess and report operational performance, bi-annual performance assessments, resolve personnel problems, assign toolset dedications, maintenance and operational priorities, provide technical training and career development, conduct technical and operational shift meetings.Managed Engineering Change Notifications.manufacturing processes and procedures and configure equipment in a leading edge manufacturing and development center.Expedites the development and refinement of manufacturing processes and their early transfer into high volume production.Led a team of technicians to perform time studies, evaluate workflow processes, and developement.

Worked as a Yield Engineer for the AMD/Motorola Alliance Job responsibilities were to help trouble shoot process problems with various shift engineers, production lot disposition, classifying defects from production lots that have failed and determining root cause of failure. Implementing statistical process control on tools with out of control points, and performing design of experiment with engineers

Worked within the natural work group (NWG), with minimal supervisionPerformed routine and complex wafer movement and scheduling, CAM/CIM transactions.Routine equipment maintenance, process diagnosis and interpretation using Statistical Process Control (SPC) methodology. Support engineering and production activities in the CMP moduleRecommended equipment and/or procedural improvements.

Responsible for executing production plan for PC boards.Responsible for training and qualifying new operators. Over 50 individuals were trained and qualified.Initiated and implemented program to improve quality audit scores, resulting in team quality scores improving by 50%.

Engineering

Graduate Level Courses in - Statistical and Reliability Methods with APC; Advanced Design of Experiments & Response Surface Methods, SPC.

Bs, Engineering

Activities and Societies: 3 year Resident AssistantGraduated with High Honors