Christopher Brannon Email & Phone Number

Allen, TX, US

SM1 Sherman, Texas

Dallas/Fort Worth Area

Eric Brannon is a proven technical leader, evidenced by his election to Senior Member Technical Staff in 2019 at TI and in 2009 at Spansion/AMD. His 9 publications, 2 patent, 3 patent application and global technical leadership positions at AMD/Spansion/TI for the past 25 years have established him as a recognized technologist in the field of.

Dallas/Fort Worth Area

Receives assignments in the form of objectives with goals and process to meet goals outlined. Provides direction to employees according to established policies and management guidance. Work is reviewed by management to measure meeting of objectives. Administers company policies that directly affect subordinate employees. Recommends changes to unit or.

Dallas/Fort Worth Area

Technical EffectivenessExpert in analytical techniques, methods of troubleshooting, and the interpretation of the results. Anticipates new developments and challenges faced in other functional areas and how they might affect his/her position. Effectively participates in cross-functional teams, and may lead teams, to solve critical and complex issues..

Responsible for development of new or modified wafer fab process formulations, definition of processing or handling equipment requirements and specifications, review of processing techniques and methods applied in the manufacture, fabrication and evaluation of semiconductors. Reviews product requirements with design staff to ensure compatibility of.

Defined and wrote process specifications and work instructions for wafer fab area, wrote preventive maintenance specifications for process and metrology tools, wrote reports detailing all experiments performed. Evaluates and recommends the selection of new process equipment. Oversaw the installation, acceptance and qualification of equipment. Tests and.

Analyzed and resolved a variety of complex technical and operational problems involving product and equipment issues on the production floor that might compromise product quality, yield and throughput. Performed statistical analysis of process trends, analysis of automated process control functionality, capacity modeling, troubleshooting of product and.

Lead engineer on shift in the Chemical Mechanical Polish (CMP) module.Performed continuous process improvement experiments and consumable evaluations. Implemented new procedures and process changes.Defined and documented isory activities included: perform all shift operational responsibilities during absence of manager, assess and report operational.

Worked as a Yield Engineer for the AMD/Motorola Alliance Job responsibilities were to help trouble shoot process problems with various shift engineers, production lot disposition, classifying defects from production lots that have failed and determining root cause of failure. Implementing statistical process control on tools with out of control points, and.

Worked within the natural work group (NWG), with minimal supervisionPerformed routine and complex wafer movement and scheduling, CAM/CIM transactions.Routine equipment maintenance, process diagnosis and interpretation using Statistical Process Control (SPC) methodology. Support engineering and production activities in the CMP moduleRecommended equipment.

Responsible for executing production plan for PC boards.Responsible for training and qualifying new operators. Over 50 individuals were trained and qualified.Initiated and implemented program to improve quality audit scores, resulting in team quality scores improving by 50%.

Engineering

Graduate Level Courses in - Statistical and Reliability Methods with APC; Advanced Design of Experiments & Response Surface Methods, SPC.

Bs, Engineering

Activities and Societies: 3 year Resident AssistantGraduated with High Honors