Eric Triplett Email & Phone Number

Austin, Texas, United States

Certified VDA 6.3 Lead Process Auditor and company subject matter expert on VDA audits. Leading world-wide company task force to reduce and eliminate Low-Tech defects and quality issues.

Austin, Texas Area

Key technical first point of contact and driver of new product introduction and new technology development for major Amkor customers / accounts in US East Sales region. Drive factory sites to meet or exceed NPI program schedule milestones and cost targets. Grew sales > 50% YoY for two consecutive years and significantly increased market share with key region customer account. Align technical roadmaps to meet customer new product introduction requirements. Launch new programs to meet or exceed cost, quality, and production yield goals. Many years of experience with several advanced package technologies including: Flip Chip BGA, Wafer Level CSP, Fan Out Wafer Level Packaging, MCM, SIP, 2.5D, 3D, Stacked Die, Stacked Package (Package on Package), and many others. Also perform VDA 6.3 supplier quality audits as Lead Auditor (only current VDA certified Lead Auditor in Amkor North America region).

San Antonio, Texas Area

Certified VDA 6.3 automotive process quality lead auditor. Manage suppliers and drive supplier quality for components and assemblies used in the manufacture of automotive electronics modules at Continental's Seguin, TX plant. Drive suppliers to meet or exceed quality key performance indicators (KPIs) for continuous improvement, including management of 8D quality incidents and critical assessment & feedback on performance. Expertise in molded plastic assemblies, housings, and connectors, and stamped metal components. Perform root cause / troubleshooting / failure analysis to determine if manufacturing issues are due to supplier quality or manufacturing process issue. Drive suppliers to meet Zero Defects targets.

Austin, Texas Area

Role summary: Managed semiconductor packaging and new product introductions for advanced Networking customers such as Alcatel-Lucent, Huawei, Nokia-Siemens, and Cisco.• Successfully launched 15 or more of the company's most advanced new products in several fab and package technologies with lifetime revenues > $100M.• Qualified and launched the company's first 28nm CMOS flip chip product on time while meeting stretch yield targets, ensuring > 50% gross margin goals met, with electrical performance exceeding targets.• Received "Diamond Chip" (company's highest team award) for successful launch of 1st 28nm product.• Launched the company's first 28nm "Layerscape" family product, with electrical performance exceeding targets.• Implemented dual-site / dual-supplier strategy, saving over $2M in lifetime package cost.• Led conversion of flip chip bump materials and processes from Pb-containing to Pb-free to comply with European environmental laws (RoHS / WEEE) and allow continued sales after 2016.• Drove innovation through six packaging-related patent innovation disclosures.• Managed several global cross-functional teams that solved critical packaging issues for networking customers using design of experiments (DOE) and structured problem solving methods (e.g. 8D), increasing customer loyalty and retention.• Developed packaging qualification plans using qual-by-similarity (QBS) to reduce qual cost and cycle times by > 25%.• Used Primavera and MS Project management to drive team to achieve critical project milestones.

Austin, Tx

Role summary: Managed semiconductor packaging and new product introductions for Wireless and Mobile Solutions customers such as Motorola, Toshiba, Hewlett-Packard, and Pioneer.Accomplishments:• Qualified / launched several key programs and package technologies for wireless / mobile applications with product lifetime revenue > $25M.• Wrote Failure Mode Effects Analysis (FMEA) for ball grid array (BGA) packages to reduce package defects by> 20%.• Performed drop / shock / bend tests to ensure component reliability for very small fine-pitch components. Qualified new materials to improve reliability by 50%.• Traveled to present Freescale package capability to Hewlett-Packard corporate headquarters to ensure future business / design wins.• Improved field reliability of parts (> 2x) and ensured passing qualifications by using X-ray, acoustic microscopy, drop / shock testing, Thermoire warpage measurements, moisture testing, etc.• Strengthened the technical team expertise by mentoring and training several junior engineers and interns.

Austin, Tx

Role summary: Managed semiconductor packaging and new product introductions for Automotive Microcontroller customers such as Delphi, DaimlerChrysler, Arrow, Visteon, Siemens, Continental, and Bosch.Accomplishments:• Led successful factory audit for Daimler-Chrysler's Process Sign Off (PSO) of Malaysia factory Ball Grid Array (BGA) package line, enabling > $10M in lifetime sales.• Successfully qualified and launched 10 or more of the highest-level reliability products for automotive engine / powertrain control products in several package technologies, lifetime revenue > $100M.

Austin, Texas Area

Position was with Motorola, Inc. Semiconductor Products Sector. Rotational engineering program consists of 4 assignments of 3 months each for total of 1 year program. At conclusion of program, I permanently placed / hired into the Motorola Semiconductor Sector Packaging / Final Mfg department.

Master Of Science (Ms), Mechanical Engineering, 4.0/4.0

Activities and Societies: U.S. Department of Energy, Oak Ridge Civilian Radioactive Waste Management Fellowship

Bachelor Of Science (Bs), Mechanical Engineering, 3.9/4.0 (Summa Cum Laude)

Activities and Societies: Sigma Gamma Tau Honor Society, Golden Key Honor Society