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Director Corporate Quality, IC Semiconductor Packaging Engineer, Technical Program ManagerI am a focused, results-driven professional with a proven track record of leading and completing complex projects through concept to production, delivering results on-time and under budget. I'm an innovative and self-motivated leader who excels at creating solutions for clients, colleagues, and the company as a whole. I have led global cross-functional teams to solve challenging technical problems and delight customers with results. I also really enjoy taking complex technical information and presenting it in a clear and insightful way.My strengths and specialties include: Zero Defects (ZD), Integrated Circuits (IC) Semiconductor Packaging and Assembly, Flip-Chip, Wafer Level CSP, and Fan-Out Wafer Level Packaging, Mechanical Engineering, Supplier Quality Engineering (SQE), New Product Introduction (NPI), Technical Project Management (TPM), VDA 6.3 Process Audits, Package / Substrate Design, Design of Experiments (DOE), 8D / Problem Solving , Heat Transfer, Thermal Analysis / System Design, Reliability / Quality, Cost Reduction, Yield Improvement, and Integrated Circuits (IC).Certified VDA 6.3 Lead Auditor, with > 20 on-site and remote audits performed of supplier factories / manufacturing sites.I have deep experience with many types of IC / Semiconductor packaging, including: Ball Grid Array (BGA) Packages, Flip Chip BGA, Thermally-Enhanced BGA, Flip Chip CSP, Wafer Level CSP, Gold and Copper Wire Bond Interconnect, Leaded Packages (QFN, QFP, SOIC, QFN).I've used Project / Program Management skills to drive Quality, New Product, and New Technology Introductions from Concept through Qualification and HVM / Safe Launch (APQP process).I've demonstrated excellent written and verbal communication skills, and have given high-quality presentations on a variety of technical topics to customers, upper management, and suppliers. I have experience leading factory certifications / audits of domestic and overseas factories.
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Director Corporate QualityAmkor Technology, Inc. Jan 2022 - PresentAustin, Texas, United StatesCertified VDA 6.3 Lead Process Auditor and company subject matter expert on VDA audits. Leading world-wide company task force to reduce and eliminate Low-Tech defects and quality issues. -
Sr Technical Program Manager (Tpm)Amkor Technology, Inc. Oct 2018 - Jan 2022Austin, Texas AreaKey technical first point of contact and driver of new product introduction and new technology development for major Amkor customers / accounts in US East Sales region. Drive factory sites to meet or exceed NPI program schedule milestones and cost targets. Grew sales > 50% YoY for two consecutive years and significantly increased market share with key region customer account. Align technical roadmaps to meet customer new product introduction requirements. Launch new programs to meet or exceed cost, quality, and production yield goals. Many years of experience with several advanced package technologies including: Flip Chip BGA, Wafer Level CSP, Fan Out Wafer Level Packaging, MCM, SIP, 2.5D, 3D, Stacked Die, Stacked Package (Package on Package), and many others. Also perform VDA 6.3 supplier quality audits as Lead Auditor (only current VDA certified Lead Auditor in Amkor North America region).
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Senior Supplier Quality EngineerContinental May 2015 - Oct 2018San Antonio, Texas AreaCertified VDA 6.3 automotive process quality lead auditor. Manage suppliers and drive supplier quality for components and assemblies used in the manufacture of automotive electronics modules at Continental's Seguin, TX plant. Drive suppliers to meet or exceed quality key performance indicators (KPIs) for continuous improvement, including management of 8D quality incidents and critical assessment & feedback on performance. Expertise in molded plastic assemblies, housings, and connectors, and stamped metal components. Perform root cause / troubleshooting / failure analysis to determine if manufacturing issues are due to supplier quality or manufacturing process issue. Drive suppliers to meet Zero Defects targets.
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Senior Ic Product Packaging Engineer / Npi Project Manager, Digital Networking ProductsFreescale Semiconductor 2008 - 2015Austin, Texas AreaRole summary: Managed semiconductor packaging and new product introductions for advanced Networking customers such as Alcatel-Lucent, Huawei, Nokia-Siemens, and Cisco.• Successfully launched 15 or more of the company's most advanced new products in several fab and package technologies with lifetime revenues > $100M.• Qualified and launched the company's first 28nm CMOS flip chip product on time while meeting stretch yield targets, ensuring > 50% gross margin goals met, with electrical performance exceeding targets.• Received "Diamond Chip" (company's highest team award) for successful launch of 1st 28nm product.• Launched the company's first 28nm "Layerscape" family product, with electrical performance exceeding targets.• Implemented dual-site / dual-supplier strategy, saving over $2M in lifetime package cost.• Led conversion of flip chip bump materials and processes from Pb-containing to Pb-free to comply with European environmental laws (RoHS / WEEE) and allow continued sales after 2016.• Drove innovation through six packaging-related patent innovation disclosures.• Managed several global cross-functional teams that solved critical packaging issues for networking customers using design of experiments (DOE) and structured problem solving methods (e.g. 8D), increasing customer loyalty and retention.• Developed packaging qualification plans using qual-by-similarity (QBS) to reduce qual cost and cycle times by > 25%.• Used Primavera and MS Project management to drive team to achieve critical project milestones. -
Ic Product Packaging Engineer / Npi Project Manager, Wireless ProductsFreescale Semiconductor 2006 - 2008Austin, TxRole summary: Managed semiconductor packaging and new product introductions for Wireless and Mobile Solutions customers such as Motorola, Toshiba, Hewlett-Packard, and Pioneer.Accomplishments:• Qualified / launched several key programs and package technologies for wireless / mobile applications with product lifetime revenue > $25M.• Wrote Failure Mode Effects Analysis (FMEA) for ball grid array (BGA) packages to reduce package defects by> 20%.• Performed drop / shock / bend tests to ensure component reliability for very small fine-pitch components. Qualified new materials to improve reliability by 50%.• Traveled to present Freescale package capability to Hewlett-Packard corporate headquarters to ensure future business / design wins.• Improved field reliability of parts (> 2x) and ensured passing qualifications by using X-ray, acoustic microscopy, drop / shock testing, Thermoire warpage measurements, moisture testing, etc.• Strengthened the technical team expertise by mentoring and training several junior engineers and interns.
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Ic Product Packaging Engineer / Npi Project Manager, Automotive ProductsMotorola 1998 - 2006Austin, TxRole summary: Managed semiconductor packaging and new product introductions for Automotive Microcontroller customers such as Delphi, DaimlerChrysler, Arrow, Visteon, Siemens, Continental, and Bosch.Accomplishments:• Led successful factory audit for Daimler-Chrysler's Process Sign Off (PSO) of Malaysia factory Ball Grid Array (BGA) package line, enabling > $10M in lifetime sales.• Successfully qualified and launched 10 or more of the highest-level reliability products for automotive engine / powertrain control products in several package technologies, lifetime revenue > $100M. -
Engineering Rotational ProgramMotorola Feb 1997 - Feb 1998Austin, Texas AreaPosition was with Motorola, Inc. Semiconductor Products Sector. Rotational engineering program consists of 4 assignments of 3 months each for total of 1 year program. At conclusion of program, I permanently placed / hired into the Motorola Semiconductor Sector Packaging / Final Mfg department.
Eric Triplett Skills
Eric Triplett Education Details
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3.9/4.0 (Summa Cum Laude)
Frequently Asked Questions about Eric Triplett
What company does Eric Triplett work for?
Eric Triplett works for Amkor Technology, Inc.
What is Eric Triplett's role at the current company?
Eric Triplett's current role is Director, Corporate Quality at Amkor Technology.
What is Eric Triplett's email address?
Eric Triplett's email address is er****@****ale.com
What is Eric Triplett's direct phone number?
Eric Triplett's direct phone number is +151277*****
What schools did Eric Triplett attend?
Eric Triplett attended The University Of Texas At Austin, The University Of Texas At Austin.
What are some of Eric Triplett's interests?
Eric Triplett has interest in Guitar, Weightlifting, Musician, Trumpet, See Less, Singer, Photography, Hiking, Camping, Running.
What skills is Eric Triplett known for?
Eric Triplett has skills like Semiconductors, Packaging, Manufacturing, Product Development, Semiconductor Industry, Engineering, Silicon, Ic, Microprocessors, Soc, Cross Functional Team Leadership, Asic.
Who are Eric Triplett's colleagues?
Eric Triplett's colleagues are Yoonki Namkung, Minji Kim, Merwin Jay Escalona, 范姜坤良, Kim Smith, Erlon Jr Sayson, Paulo Teixeira.
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Eric Triplett
Monrovia, Ca2erictriplett.com, wkelmsolutions.com1 +162641XXXXX
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