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Evan Olson is listed as TD Module Development Engineer at Intel Corporation based in Portland, Oregon Metropolitan Area, United States. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Evan Olson.
Evan Olson previously worked as TD Module Development Engineer at Intel Corporation and Packaging R&D Engineer at Intel Corporation. Evan Olson holds Bachelor’S Degree, Mechanical Engineering; Manufacturing from Rensselaer Polytechnic Institute.
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AeroLeads found 1 current-domain work email signal for Evan Olson. Compare company email patterns before reaching out.
I’m am currently a TD Module Development Engineer with Intel. In this role, I provide equipment ownership of First of a Kind (FOK) carrier debonding tools and process development to enable next generation wafer packaging. Within Intel, I was also previously working as a Shift Engineer, working to support New Product Introductions (NPIs) across multiple wafer packaging toolsets.Before joining Intel, I worked at Screen providing troubleshooting and repair of wafer annealing equipment to support customer processes.I was employed at Cisco Systems, a leader in networking technology, performing critical thermal, airflow and acoustic development on networking switches.I've also worked for an aerospace manufacturing company — RBC Bearings –- and was able to work with amazing clients such as Boeing, Airbus, and Sikorsky. Prior to completing college, I was fortunate enough to do an 8 month CoOp with Apple Inc. and see larger scale manufacturing while travelling internationally to China.I’m truly passionate about my work and always eager to connect with others in the field. While I enjoy all aspects of my job, I think my favorite part of work is streamlining a functional project and squeezing out the last few percentage points of yield to try and achieve 6 Sigma. I have a B.S. from Rensselaer Polytechnic Institute in Mechanical Engineering with a focus in Manufacturing.I’m always interested in hearing from former colleagues, managers, or just interesting creative folk, so feel free to contact me if you’d like to connect.
Listed skills include Manufacturing Engineering, Machining, Engineering, Design For Manufacturing, and 29 others.
A career timeline built from the work history available for this profile.
Hillsboro, Oregon, United States
- Equipment ownership of First of a Kind (FOK) temporary carrier debonding, wafer cleaning/mounting tool.- Development of laser ablation process to enable next generation wafer packaging technologies on thin substrates- Organized and qualified equipment performance upgrades through Golden Tool ownership and proliferation
Hillsboro, Or
Provide onsite support for installation, maintenance and site support for state-of-the-art semiconductor manufacturing/processing equipment . Perform extensive electro-mechanical troubleshooting. Diagnose equipment problems and make repairs/adjustments quickly. Understand system parameters and process recipe interactions to allow process development and troubleshooting with the assistance of the customer and SCREEN Process Engineers.
San Jose,Ca
• Development and testing of thermal characteristics of networking hardware• Design and conduct airflow testing to create cooling and impedance profile• Perform acoustic test validation to meet industry standards (NEBS)• Optimize quality and efficiency through automation of testing
Oxford, Ct
Set up and conduct testing of aerospace and industrial bearings from all company divisionsProvided detailed analysis and reports of test results including failure modes, bearing life analysis, test methods, and design improvementsDesigned and built test machines and tooling/fixtures
Oxford,Ct
Program a variety of Lathes using Mastercam X6Manage induction heat treatment processRun off and purchase large scale equipmentDevelop and improve upon new manufacturing processes
Designed and created engineering projectsCollapsible walker, bushings, complex keychain designs, coat rackOperate water jet and laser cutter for the school of engineeringTrained in Master Cam X2MR2Used CNC mill and latheCreated an efficient organization system for the design shop's tools
Quick answers generated from the profile data available on this page.
Evan Olson is listed as TD Module Development Engineer at Intel Corporation.
AeroLeads has found 1 work email signal at @intel.com for Evan Olson.
Evan Olson is based in Portland, Oregon Metropolitan Area, United States.
Evan Olson has worked for Intel Corporation, Screen, Cisco, Rbc Bearings, and Apple.
You can use AeroLeads to view verified contact signals for Evan Olson, including work email, phone, and LinkedIn data when available.
Evan Olson holds Bachelor’S Degree, Mechanical Engineering; Manufacturing from Rensselaer Polytechnic Institute.
Evan Olson is listed with skills including Manufacturing Engineering, Machining, Engineering, Design For Manufacturing, Lathe, Cam, Finite Element Analysis, and Solidworks.
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