I’m am currently a TD Module Development Engineer with Intel. In this role, I provide equipment ownership of First of a Kind (FOK) carrier debonding tools and process development to enable next generation wafer packaging. Within Intel, I was also previously working as a Shift Engineer, working to support New Product Introductions (NPIs) across multiple wafer packaging toolsets.Before joining Intel, I worked at Screen providing troubleshooting and repair of wafer annealing equipment to support customer processes.I was employed at Cisco Systems, a leader in networking technology, performing critical thermal, airflow and acoustic development on networking switches.I've also worked for an aerospace manufacturing company — RBC Bearings –- and was able to work with amazing clients such as Boeing, Airbus, and Sikorsky. Prior to completing college, I was fortunate enough to do an 8 month CoOp with Apple Inc. and see larger scale manufacturing while travelling internationally to China.I’m truly passionate about my work and always eager to connect with others in the field. While I enjoy all aspects of my job, I think my favorite part of work is streamlining a functional project and squeezing out the last few percentage points of yield to try and achieve 6 Sigma. I have a B.S. from Rensselaer Polytechnic Institute in Mechanical Engineering with a focus in Manufacturing.I’m always interested in hearing from former colleagues, managers, or just interesting creative folk, so feel free to contact me if you’d like to connect.