Gary Ng Email & Phone Number

Fremont, Ca

Managed process engineering group to develop and sustain processes required for the manufacture of the optical transceivers. Responsibilities include:Set up and qualified assembly line for volume manufacturing. Processes include: die bond (flip chip, eutectic, and epoxy), wire bond, hermetic seal, leak test, laser weld, and optical alignment.Transfer assembly line to off shore facilities and provided ongoing technical support and training.Technical leader on teams which resolved multiple production and reliability issues.Developed and optimized packaging processes and designs to increase yield and reliability.Evaluated different packaging materials to optimize performance.Documented processes and trained engineers and technicians to operate equipment.Designed tooling and fixtures using Solid Works.Mentor engineering staff on problem solving approaches and methodology.Established annual metrics for engineering staff and assist in their career development.