George Ding Email and Phone Number

1. Manage customers from Europe; 2. Leading and coordinating new engineering device and qualification run until mass production; 3. Leading the team as well as efficient communicate with customer for the new-pkg development pertinent event and design review; 4. Work with planner and enable team to ensure sample readiness to support customer's new product development request.

1. Be responsible for the process improvement of wafer back grinding,wafer saw,die bond(include yield improvement and cost down); 2. Perform advanced research of new process,join the discussion of APQP and participate the new process input job; 3. Buy off of new technology-related machine. Do the evaluation of new DM\IDM and application promotion; 4. Draft the SOP to train operator with new skill and increase their awareness; 5. Revise related technical documentation,such as PFMEA,Control Plan and OCAP; 6. Take part in the 5S improvement activities with the promotion of group; 7. Review project report with customer.