Gerard Michaud Email and Phone Number

Have enjoyed opportunities with stimulating and rewarding technical work that focused on system-level issues and challenges.

Managed System Engineering functions of a product platform program, worked with Cross Functional Team to deliver system reliability plan and analysis, product BOM structuring, and verification test requirements. Supported Product Management in the development of Product Useability Requirements as inputs to Product Validation Testing. Completed and updated multi-year project plans and budget estimates for Review Board.Provided systems engineering design and analysis on a next-generation product platform for warming therapy devices based upon common modules and functional subsystems.Completed an entire portfolio of technical product requirement documents including Product and User Requirements, Technical System Requirements (TSR), Technical Subsystem Requirements (TSSR), and a Program Design and Development Plan (D&D).Defined a System Architecture that encompassed multi-disciplinary functional modules and their interfaces.R&D Intellectual Property (IP) Administrator – maintained Draeger patent portfolio of over 150 patents and applications: acted as liaison with patent lawyers, evaluating new invention disclosures.

Provided contract consultation for an east coast High Brightness LED manufacturer, defining system requirements and developing specifications for both process and information factory automation.Provided expertise in automation systems, semiconductor assembly equipment, material identification, tracking and traceability in manufacturing.Completed equipment and MES software supplier evaluation/selection process, system installation, integration and full-factory operability on-time and within program budget.

Developed and presented system proposals on semiconductor assembly automation and integration of factory-wide information for equipment, materials, and processes.Managed integration, development and installation of prototype automated material handling system at customer facility in the Philippines. Implemented customer solution, reducing cycle time from 14 to 3 days and Work in Process (WIP) by 78% without the expense of an automated monorail solution.Led design and development team that delivered $1.4M integrated line for the assembly of RFID Tags.Generated wire bonder market analysis models based upon forecasted interconnection and IC package growth.Managed design, fabrication, integration, and installation of equipment and showcase facilities at Semicon West ’97 Trade Show; required extensive liaison with multiple suppliers to provide a ‘World Class’ showcase for products.Recipient of an ‘On-the-Spot’ award for successful completion of project.Provided system-level analysis of new high speed, high accuracy semiconductor assembly products.Wrote all system and subsystem specifications, performed system tolerance, reliability, timing analyses for the 8020/8028 Wire Bonder and for new generation K&S Die Bonder. The system approach contributed to reducing product development time from 36 to 18 months for each new model.Coordinated, wrote and edited 30 Engineering Department Policy & Procedure documents, which were instrumental for gaining ISO-9001 Certification for Product Development.

Member Technical Staff & Engineering Section Manager