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Gokul Kumar Email & Phone Number
Senior Director of Packaging - Package Design and Development
at
Micron Technology
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✓ Verified August 2026
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Current company
Role
Senior Director of Packaging - Package Design and Development
Location
United States
Company size
Who is Gokul Kumar? Overview
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Quick answer
Gokul Kumar is listed as Senior Director of Packaging - Package Design and Development at Micron Technology, a with 32782 employees, based in United States. AeroLeads shows a matched LinkedIn profile for Gokul Kumar.
Gokul Kumar previously worked as Senior Director of Packaging - Package Design & Development at Micron Technology and Director - Package Development and Engineering at Micron Technology. Gokul Kumar holds Bachelor Of Engineering (B.E.), Electrical, Electronics And Communications Engineering from Anna University Chennai.
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Email format at Micron Technology
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Micron Technology
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Profile bio
About Gokul Kumar
Over 10 years cumulative experience in electronic packaging, with multi-disciplinary background - encompassing design analysis, physical design/layout, signal/power integrity, process and substrate fabrication, validation and product development. Specialties include: Electrical Modeling/Simulation, Signal Integrity, Power Integrity, Design Guidelines Development, 2.5D/3D Integration, WL-CSP, Through-Silicon-Vias, Glass Interposers, Advanced Packaging, Die-embedding, Substrates, High speed PCB/Board design
Current workplace
Gokul Kumar's current company
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Micron Technology
11 roles · 12 years
Gokul Kumar work experience
A career timeline built from the work history available for this profile.
Senior Director Of Packaging - Package Design & Development
CurrentBuilding dynamic & multi-functional (simulation, substrate technologies, Data sciences & EDA etc.) global teams to deliver cutting-edge packaging solutions for advanced semiconductor applications
Nov 2022 - Present
Director - Package Development And Engineering
Mar 2020 - Aug 2023
Senior Manager - Package Design
Manage complex design executions, all the way from feasibility into HVM; Variety of applications including ASICs, High Bandwidth DDR, TSVs, Flash and X-point packages
Oct 2019 - Mar 2020
Principal Engineer
Extensive efforts to develop Flip-chip based advanced packages and 3D integration
2015 - Oct 2019
Staff Packaging Engineer
I work to define future Packaging Architecture for client and high-performance solution spaces, including qualifications, power, signal and thermal budgets.
Jan 2017 - Jan 2018
Senior Packaging Engineer
I work closely with all aspects of Electronic Packaging. Particular areas of specialization include package design/definition, signal and Power Integrity, EMI/EMC Compatibility, and Qualification all the way to high volume manufacturing.
Jun 2015 - Jan 2017
Technical Program Manager - 3D Integration And Embedded Die
* System (on-chip+interposer+package+PWB) SI/PI analysis of multi-chip packages with 3D interconnects and RDL by combining spice and full wave EM solvers * First design and demonstration of double-side 3D interposers with ultra-small pitch Through-package-vias in glass at the same or smaller pitch than TSVs* Developed techniques for resonance-free power delivery network for 3D glass interposers using novel decoupling capacitors and coaxial vias* Optimized package layout to prevent stack-up impedance mismatch and RPD * Formulated multi-dimension modeling methodology and design guidelines for glass substrate test vehicles, establishing process-of-record (POR) towards manufacturing* Performance trade-offs between glass, organic and silicon interposers for timing and bandwidth
Jan 2010 - Jun 2015
Engineering
- Novel assembly methods for low-cost packaging applications, focusing on prototype demonstration - Specifications for low-loss RDL wiring designs to meet multiple semiconductor process methods
May 2012 - Aug 2012
Jan 2007 - Jul 2008
Electrical Engineering
Designed AMBA and AHB high speed bus address schemes using Verilog
Dec 2006 - Apr 2007
Team & coworkers
Colleagues at Micron Technology
Other employees you can reach at micron.com. View company contacts for 32782 employees →
SK
Sheshendra Kandregula
Colleague at Micron TechnologyHyderabad, Telangana, India
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MB
Mandar Bhoir
Colleague at Micron TechnologyBoise, Idaho, United States
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CD
Cyuan De Yang
Colleague at Micron TechnologyTaiwan, Province Of China
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VK
Vijaykumar Kommu
Colleague at Micron TechnologyHyderabad, Telangana, India
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ML
Mona Leigh
Colleague at Micron TechnologyMeridian, Idaho, United States
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RH
Robert Hanson
Colleague at Micron TechnologyBoise, Idaho, United States
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AK
Amith K Vodela
Colleague at Micron TechnologyHyderabad, Telangana, India
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MH
Md.Azad Hasan
Colleague at Micron TechnologyDhaka, Bangladesh
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TB
Tejasman Burugu
Colleague at Micron TechnologyTelangana, India
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JW
John Winegard
Colleague at Micron TechnologyPlano, Texas, United States
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Sheshendra Kandregula
Colleague at Micron TechnologyHyderabad, Telangana, India
View →
MB
Mandar Bhoir
Colleague at Micron TechnologyBoise, Idaho, United States
View →
CD
Cyuan De Yang
Colleague at Micron TechnologyTaiwan, Province Of China
View →
VK
Vijaykumar Kommu
Colleague at Micron TechnologyHyderabad, Telangana, India
View →
ML
Mona Leigh
Colleague at Micron TechnologyMeridian, Idaho, United States
View →
RH
Robert Hanson
Colleague at Micron TechnologyBoise, Idaho, United States
View →
AK
Amith K Vodela
Colleague at Micron TechnologyHyderabad, Telangana, India
View →
MH
Md.Azad Hasan
Colleague at Micron TechnologyDhaka, Bangladesh
View →
TB
Tejasman Burugu
Colleague at Micron TechnologyTelangana, India
View →
JW
John Winegard
Colleague at Micron TechnologyPlano, Texas, United States
View →
3 education records
Gokul Kumar education
Bachelor Of Engineering (B.E.), Electrical, Electronics And Communications Engineering
Anna University Chennai
Phd, Electrical And Computer Engineering
Georgia Institute Of Technology
Master Of Science, Electrical And Computer Engineering
Georgia Institute Of Technology
FAQ
Frequently asked questions about Gokul Kumar
Quick answers generated from the profile data available on this page.
What company does Gokul Kumar work for?
Gokul Kumar works for Micron Technology.
What is Gokul Kumar's role at Micron Technology?
Gokul Kumar is listed as Senior Director of Packaging - Package Design and Development at Micron Technology.
Where is Gokul Kumar based?
Gokul Kumar is based in United States while working with Micron Technology.
What companies has Gokul Kumar worked for?
Gokul Kumar has worked for Micron Technology, Western Digital, Sandisk, A Western Digital Brand, Georgia Institute Of Technology, and Qualcomm.
Who are Gokul Kumar's colleagues at Micron Technology?
Gokul Kumar's colleagues at Micron Technology include Sheshendra Kandregula, Mandar Bhoir, Cyuan De Yang, Vijaykumar Kommu, and Mona Leigh.
How can I contact Gokul Kumar?
You can use AeroLeads to view verified contact signals for Gokul Kumar at Micron Technology, including work email, phone, and LinkedIn data when available.
What schools did Gokul Kumar attend?
Gokul Kumar holds Bachelor Of Engineering (B.E.), Electrical, Electronics And Communications Engineering from Anna University Chennai.
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