• Developed several signal/image processing applications including evaluation of LED illumination uniformity, die count/die orientation of die sheets shipped to customer, wafer piece maker, wafer grind pattern determination, identification of wafer EPI cracks, evaluation of wafer edge, die level feature measurement and pattern recognition, defect detection and wafer abnormalities/processing affects.• Developed white light interface measurement system • Responsible for the probe platform used to test power LED material. Developed OCR system integrating In-Sight hardware into probe platform.• Reduced wafer probing up to 35% on newest probe platform.

Firmware/Systems Engineer - Image Sensor Solutions 1/2007 – 1/2010• Developed demonstration system of video encoding using embedded Linux on a Texas Instrument DM365 evaluation kit. • Developed software to use Analog Devices Blackfin processor as a controller for a stepper motor/lens assembly to control lens zoom drive for evaluation/demonstration. • Developed software on a Texas Instruments DM350 for the preview path of digital camera; embedding algorithms which added features including lens auto focus, lens shading control, gain masks and defect detection.• Co-developed demonstration system where the TI DM350 was used as slave to a FPGA chip• Co-developed and maintained the internal software tool-set and hardware frame work used for production test and characterization of all CMOS and CCD image sensors. The test systems were PC based custom built using industry available hardware instrumentation and were used for parametric, characterization, wafer and package testing of image sensors.• Consistently challenged with developing unique image processing algorithms which improved measurement and defect detection capability while reducing test time without compromising accuracy.• Responsible for developing hardware interface, algorithms ranged from developing instrument drivers over GPIB to I/O address register mapping for M-modules on a 4000 Quad M-module carrier for VME bus (M33 8 channel analog output and MA204 50MHz pulse generator).• Developed offline wafer level image processing capability to minimize wafer test time for both characterization and production testing, this achieved a 50% reduction in test time.• Developed application which remotely presented real time information on wafer probe test systems, providing current yield, failure statistics and estimated time of wafer test completion.