Greg Hew Email & Phone Number

Singapore

Singapore

- Leading the team in NPI in driving for Product VNC characterization, HTE and CTE elimination, Power Margin assessment Hardware qualification and Production readiness- Leading team in driving for production yield improvement to 99% and cost reduction such as TTR, assembly improvement and process optimization.- Managing and coordinating Special Customer.

Singapore

• Virtex Product lead for sustaining and improvement continuity. Responsibilities includes chairing Test Change Control board (CCB) and coordinating Special Customer Demand (SCD), ensure efficient and improvement in.
• Achieve huge long term revenue by managing special customer demand (SCD) requests.
• Monitor and Control change in scope, resource, budget and risk
• Demonstrate efficiency improvement of 20-30% man-hour by leading project of new tool implementation for process improvement.
• Improve speed test binning results additional revenue and better product quality by leading Project for Dynamic AC Temperature Compensation.
• Improve production maturity yield of 99-98% with 100% WS-FT correlation for all Virtex 7 devices.

Penang Malaysia

• Product Development Engineer (PDE), May 2008 – May 2010 (INTEL MALAYSIA, Penang Design Centre, Penang Malaysia)FUSE BLOCK expert and Test Program Integrator for INTEL Low Power & Digital Home Atom Processor..
• Full responsibility of Fuse Block from test pattern generation/validation/improvements, and defining HVM Production fuse flow for all SKUs.
• Chairing Fuse CCB to coordinate with Marketing on specific customer SKUs fuse settings.
• Responsible as a test integrator in driving all test content for HVM test program ensuring test program meeting all HVM PHI requirementsKey accomplishments:
• Received several divisional awards for enabling Intel first System On Chip “Lincroft” to High Volume Manufacturing
• Received several departmental awards for successfully reaching High Volume Manufacturing several new SKUs for Intel Atom Chip “Silverthorne”.

Kulim, Malaysia

• Product Test Engineer for 2 Sustaining Product and 1 NPI Product. Also own the Consign Spare Equipment management and Capacity Improvement Team Chairperson
• Product Owner of 10Gbps “XFP”, “Xenpak” and 300pins form factor Transceivers and Integrated Tunable Laser Asembly (ITLA).
• Driving equipment capacity improvements with minimal investment.
• Project Lead for Contract Manufacturer (CM) Project consolidation between Penang and Bangkok.
• NPI Product Transfer ITLA from US to production in Bangkok.Key accomplishments:
• Increase equipment capacity by 30% and cost saving.

Master Of Engineering (Meng), Mems (Microelectromechanical System)

Bachelor Of Engineering (Beng), Electrical And Electronics Engineering