Hassan Harb Email and Phone Number
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Wealth of experience in the areas of Program/Project Management, Product and Test Development-Management on a broad mix of SoC products, ranging from low pin count ASIC to a very large pin count complex networking devices. Product portfolio includes, but not limited to, ASIC, Microcontrollers (8/16/32/64-bit), Sensors, MEMS, Motor Control, DSP, USB, Wireless, RF, Set-Top box, Network, and Multi-Media. Driving cost effective and high growth margin products. NPI (from concept to high volume production), developed and manufactured on state of the art FAB process, probe, assembly, burn-in, and final test technologies, qualified to worldwide industrial, automotive, and Mil standards (QS9xxx, AEC, and Mil-8xx). • Drive cost reduction activities: design shrinks, process, assembly, test and manufacturing flows to increase gross margins, profits and maintain competitive market share. This is resulting in multi-million dollars annual savings. • Recognized for advanced knowledge and Global Technical Leadership capabilities. Designated MMTS.• Program Manager Skills, from concept to production for three key projects: TPMS, Control panel Networking and Wireless infrastructures, and Navigation system.• New product evaluation, characterization, qualification and release-to-production. • Gross Margin improvements through cost reductions Yields (Fab, Assembly and Test), BI, TTR, Test Insert Reduction, Parallelism, improve manufacturing equipment utilization and increase throughput.• Interface directly with customers on technical issues and drive for effective resolutions.• Develop and Manage global Product and Test Engineering teams in both NPI and Sustaining.• Effective people and projects management.• Quality goals and achievements. • Effective group coordination and interaction. • Interface with Suppliers and Manufacturing plants.• Deliver on commitments. • Strong communication skills.• Proven problem solving track record.Specialties: Engineering Management position in the area of Product & Test or Quality or Program/Project Management. Expertise in New Product Introduction (NPI) from inception phase into high volume production of semiconductor system-on-chip solution with mixed analog and digital technology.
On Semiconductor
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Product Engineering Manager (Npd And Cost Reduction)On SemiconductorGilbert, Az, Us -
Product Engineering Manager (Npd & Cost Reduction)On Semiconductor Jul 2013 - PresentPhoenix, ArizonaON Semiconductor July 2013 to Present Phoenix, AZNew Products Development:NPD projects consists of new products development from feasibility phase to release-to-production.Currently managing a technical team of Product Leaders for Logic and Memory IC products. Prior role, Managed a technical team of Projects Leaders for eFuse, eRelay, eBreaker IC products.Previous role, Managed a team of technical Project Leaders for discrete products (Protection and Small Signal).Strategic Cost Reduction:Managed a global engineering team for implementing and monitoring major cost reduction activities in various manufacturing sites. Cost reduction activities in areas of wafer fab, assembly, and final test. Achieved $12 Million Dollars of cost savings annually for 4 consecutive years.• Drive strategic cost reduction activities include design shrinks (MBAV99), process improvements (Au-Pt thickness), assembly (top 6 cost offenders), test yields (97%), and manufacturing flows (optimization) to increase gross margins, profits and maintain competitive market share position. -
Sr. Product And Test Engineering Manager Sasd / Npi Product Manager Nmg-Npd / Sr. Manager P&T DhoFreescale Semiconductor, Inc. Jul 2008 - Dec 2012Tempe, Az / Austin, Tx / Chandler, AzFreescale Semiconductor July 2008 to Dec 2012. Tempe, AZ / Austin, TX / Chandler, AZSr. Product and Test Engineering Manager SASD / NPI Product Manager NMG-NPD / Sr. Manager Product & Test NMG-DHO• Designated Managing Member of Technical Staff (MMTS). Recognized for advanced knowledge and technical leadership capabilities.• Drive Gross Margin improvements thru Cost Reduction activities focusing on top revenue Auto and C&I products. Focused activities on Yield Improvements (probe, assembly, test) and Test Time Reduction. • Manage a global product & test sustaining team for Auto & C&I Sensors products. • Manage MEMS engineering labs (equipment's and personnel) to support product testing for customer samples, qualification samples, DOE’s, CQI’s, and FA samples. • Responsible for New Product Introduction (NPI-DHO) and sustaining of high volume products in production.• Develop competitive products (DHO) in three major market areas: RF, Set-top boxes and Networking. • Perform new silicon evaluation, characterization and qualifications to Industrial and Automotive markets. • Perform die and package qualifications for both internal and external FAB, Assembly and Test sites.• Championed a Task Force Team to evaluate and recommend the next generation low cost tester platform for the Ultra Low End/Low Power Networking products. Resulted with major cost savings.• Achieved record number of new product releases (Qualification, Characterization, and release to production) in one single quarter. • End-of-life older, low volume, and low revenue products. Transfer high revenue products to internal and external manufacturing sites (FAB, Assembly, and Test).
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Director Of Engineering (Product & Test) , Consumer & Computation Division (Ccd)Cypress Semiconductor Corp. Sep 2006 - Jul 2008Lynnwood, Wa• Responsible for the development of new PSoC products roadmap (8/32-bit Microcontrollers) and support of existing PSoC (8-bit), USB, Wireless USB, and RF products.• Performed silicon validation, characterization, qualification, and release to production.• Managed global product and test engineering groups (WA, India, Philippines). • Managed P&L for the global product and test groups. • Developed New Product Plans (NPP) and schedules, from design phase through high volume production. • Set targets/goals for profit improvements (low cost wafer sort, assembly and final test, high yields, and high quality indices (low PPM and DPM), excellent AOQ, and zero retest/rework).• Key contributor to increase market share in both automotive and commercial markets. -
Product & Test Engineering Department Manager, Digital Signal Controller Division (Dscd)Microchip Technology Inc. Nov 2000 - Sep 2006Chandler, Az• Established (staff and manage) the Product & Test Engineering Department for the new dsPIC Division. • Developed the new dsPIC products roadmap and supervised overall product plans and schedules.• Special focus on time-to-market products. • Managed all dsPIC NPI. The dsPIC products consist of Integrated DSP and CPU as the Core architecture with Analog and Digital peripherals. • Managed three engineering groups: Product & Test development, and Manufacturing support. • Developed roadmaps for low cost/low pin count and high profit margin products. • Developed plans for lower cost improvements at probe, assembly, Final test, and QA. • Developed Test program plans with built-in high quality tests using low cost testers. • Developed plans for test-case simulation and test pattern generation utilizing Automated Cadence Tools.• Performed new product/process evaluation, characterization, qualification, and release to production.• Performed specific NVM-Flash reliability testing. • Developed product & test engineering training plans and provided offshore training for sustaining group. -
Customer Focused Account Product Manager/Program Manager/Engineer-Scientist/Prod Engr MngrMotorola Inc. Jul 1992 - Nov 2000Austin-Tx And Munich-GermanyCustomer Focused Acct Product Manager Jan 2000 to Nov 2000 Austin, TX• Provided Technical and Tactical resolutions for a major automotive customer.• Special focus on exceeding customer expectations. • Product Performance & Quality and On-time delivery. • Promoting System Solutions.• Competitive pricing.Program Manager Feb 1998 to Dec 1999 Munich, Germany• Managed a global team (Design, Technology, Fab, Assembly, Product, Test, and Mfg.) • Customer interaction in product & spec definition (HC12 based) and product road maps. • Set stage for product/system market value and advice sales with price negotiations.• Project planning and delivery dates.• Defining next low cost tester platform for Hyperintegration products.• Provide system solutions for future automotive electronic applications.Engineer/Scientist Staff Principal and Product Engr. Manager July 1995 to Feb 1998 Austin, TX• Developed the HC11 product shrink roadmap. Lead the engineering efforts to qualify the first 68HC11E9 73% shrink product in MOS5 and fan it out to other Motorola Fab's.• Lead a cross-functional team to develop and qualify the Robust IDR process, which resulted in significant EEPROM endurance improvement (10X improvement) and also lead to the elimination of Burn-In.Staff Product Engineer and Engineering Team Leader July 1993 to July 1995 Austin, TX• HC11 product introduction. Lead a small team of product engineers to develop test programs and test patterns, provided customer samples, qualified and released products to production (local and offshore).• Introduced cost reduction processes (No Retest of Rejects, Multi-DUT testing) on Advantest T33XX testers.Staff Product Engineer July 1992 to July 1993 Austin, TX• Responsible for probe and final test hardware design.• Developed Test programs for several HC11 products.• Performed HC11 products (50% and 60% shrink) qualification and release to production.• Transferred HC11 products to offshore test facilities.
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Principal Engineer/Team LeaderNational Semiconductor Corp. Oct 1988 - Jul 1992West Jordan, Utah• Designed HW and developed test SW for wafer probe on Teradyne A300 mixed signal testers.• Analyzed electrical test data collected from process monitoring wafers.• Designed experiments to evaluate process shifts and its impact on product yield and performance.• Designed wafer process targets (Critical dimensions, Alignment keys, Vernier) for process monitoring.• Verified layout plots of all incoming Analog products.• Implemented Inspection procedures for incoming masks/reticles to ensure good probe yield.
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Senior Product-Test Engineer/Team LeaderIntel Corporation Sep 1987 - Sep 1988Chandler, Az• Responsible for the 80C451 Product and Test development.• Designed hardware and developed test software for 80C451 probe and final test on Teradyne J941 testers.• Perform cold test elimination experiments.• Qualified and released to production (local and offshore) existing 80C51 product derivatives.• Performed product characterization and tester-to-tester correlation.• Conducted root cause analysis on low yielding material (wafers and parts).
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Test Development EngineerAmerican Microsystems Inc. Jun 1984 - Sep 1987Pocatello, Id• Developed Test program for mixed signal products (CMOS DAC, Medical, Telecom and Disk Drive IC’s).• Designed probe and final test HW and SW on Teradyne A300, and Sentry VII and XXI testers.• Generated test patterns from simulation phase to tester platform.• Performed product test evaluation, characterization, qualification, and released quality TP’s to production.
Hassan Harb Skills
Hassan Harb Education Details
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Business Management -
Bsee And Minor In Physics
Frequently Asked Questions about Hassan Harb
What company does Hassan Harb work for?
Hassan Harb works for On Semiconductor
What is Hassan Harb's role at the current company?
Hassan Harb's current role is Product Engineering Manager (NPD and Cost Reduction).
What is Hassan Harb's email address?
Hassan Harb's email address is hh****@****cox.net
What schools did Hassan Harb attend?
Hassan Harb attended University Of Phoenix, Utah State University.
What are some of Hassan Harb's interests?
Hassan Harb has interest in Social Services, Politics, Education, Environment, Science And Technology, Human Rights, Health.
What skills is Hassan Harb known for?
Hassan Harb has skills like Semiconductors, Soc, Analog, Asic, Ic, Testing, Engineering Management, Electronics, Product Engineering, Test Engineering, Rf, Debugging.
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Hassan Harb
Postdoctoral Researcher @ Argonne National Laboratory | Phd, Quantum ChemistryGreater Chicago Area1anl.gov2 +120926XXXXX
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